公开(公告)号：US20220181246A1

公开(公告)日：2022-06-09

申请号：US17456806

申请日：2021-11-29

Applicant: Infineon Technologies AG

Inventor： Walter HARTNER ,  Francesca ARCIONI ,  Tuncay ERDOEL ,  Vincenzo FIORE ,  Helmut KOLLMANN ,  Arif RONI ,  Emanuele STAVAGNA ,  Christoph WAGNER

IPC: H01L23/498 ,  H01L23/66 ,  H01L23/552 ,  H01L23/00 ,  H01L23/528

Abstract: A semiconductor device includes a semiconductor chip including an electrical contact arranged on a main surface of the semiconductor chip, an external connection element configured to provide a first electrical connection between the semiconductor device and a printed circuit board, and an electrical redistribution layer extending in a direction parallel to the main surface of the semiconductor chip and configured to provide a second electrical connection between the electrical contact of the semiconductor chip and the external connection element. The electrical redistribution layer includes a ground line connected to a ground potential and a signal line configured to carry an electrical signal having a wavelength.