公开(公告)号：US20220379670A1

公开(公告)日：2022-12-01

申请号：US17335458

申请日：2021-06-01

Applicant: Infineon Technologies AG

Inventor： Michael KANDLER ,  Thomas ENGL ,  Tuncay ERDOEL ,  Maximilian WERNER ,  Maciej WOJNOWSKI

IPC: B60C23/04 ,  B60C11/24

Abstract: A tire pressure monitoring system (TPMS) includes a communication interface device configured to communicate with a target TPMS sensor module. The communication interface device include a radio frequency (RF) transceiver configured to generate at least one wake-up signal; an antenna array configured to transmit each wake-up signal as a directional RF beam; a processing circuit configured to monitor for a response signal in response to the antenna array transmitting the at least one wake-up signal; and a power amplifier configured to set a power of each wake-up signal according to an adjustable power setting such that the power of each subsequent wake-up signal is increased in discrete steps until the response signal is received by the RF transceiver.

公开(公告)号：US20220415830A1

公开(公告)日：2022-12-29

申请号：US17356831

申请日：2021-06-24

Applicant: Infineon Technologies AG

Inventor： Tuncay ERDOEL ,  Walter HARTNER ,  Ulrich MOELLER ,  Bernhard RIEDER ,  Ernst SELER ,  Maciej WOJNOWSKI

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01P3/12 ,  H01Q1/22

Abstract: A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SIW and the chip and a SIW-to-waveguide transition structure configured to couple the signal out of the SIW or into the SIW, wherein the SIW-to-waveguide transition structure includes a waveguide aperture; and a plurality of electrical interfaces arranged about a periphery of the waveguide aperture, the plurality of electrical interfaces configured to receive the signal from the SIW-to-waveguide transition structure and output the signal from the chip package or to couple the signal to the SIW-to-waveguide transition structure and into the chip package.

公开(公告)号：US20220247089A1

公开(公告)日：2022-08-04

申请号：US17648730

申请日：2022-01-24

Applicant: Infineon Technologies AG

Inventor： Walter HARTNER ,  Tuncay ERDOEL ,  Klaus ELIAN ,  Christian GEISSLER ,  Bernhard RIEDER ,  Rainer Markus SCHALLER ,  Horst THEUSS ,  Maciej WOJNOWSKI

IPC: H01Q21/00 ,  H01Q1/52 ,  H01Q1/38 ,  H01Q1/16

Abstract: A radio-frequency device comprises a printed circuit board and a radio-frequency package having a radio-frequency chip and a radio-frequency radiation element, the radio-frequency package being mounted on the printed circuit board. The radio-frequency device furthermore comprises a waveguide component having a waveguide, wherein the radio-frequency radiation element is configured to radiate transmission signals into the waveguide and/or to receive reception signals via the waveguide. The radio-frequency device furthermore comprises a gap arranged between a first side of the radio-frequency package and a second side of the waveguide component, and a shielding structure, which is configured: to permit a relative movement between the radio-frequency package and the waveguide component in a first direction perpendicular to the first side of the radio-frequency package, and to shield the transmission signals and/or the reception signals in such a way that a propagation of the signals via the gap is attenuated or prevented.

公开(公告)号：US20240030092A1

公开(公告)日：2024-01-25

申请号：US18351284

申请日：2023-07-12

Applicant: Infineon Technologies AG

Inventor： Tuncay ERDOEL ,  Walter HARTNER ,  Pietro BRENNER ,  Simon KORNPROBST ,  Martin MAYER

IPC: H01L23/373 ,  H01L23/552 ,  H01L23/31

CPC classification number: H01L23/373 ,  H01L23/552 ,  H01L23/3107

Abstract: A device includes a radio frequency chip and a heat sink arranged over the radio frequency chip. The device further includes a layer stack arranged between the radio frequency chip and the heat sink. The layer stack includes a first layer including a first material, a thermal interface material, and a metal layer arranged between the first material and the thermal interface material.

公开(公告)号：US20220181246A1

公开(公告)日：2022-06-09

申请号：US17456806

申请日：2021-11-29

Applicant: Infineon Technologies AG

Inventor： Walter HARTNER ,  Francesca ARCIONI ,  Tuncay ERDOEL ,  Vincenzo FIORE ,  Helmut KOLLMANN ,  Arif RONI ,  Emanuele STAVAGNA ,  Christoph WAGNER

IPC: H01L23/498 ,  H01L23/66 ,  H01L23/552 ,  H01L23/00 ,  H01L23/528

Abstract: A semiconductor device includes a semiconductor chip including an electrical contact arranged on a main surface of the semiconductor chip, an external connection element configured to provide a first electrical connection between the semiconductor device and a printed circuit board, and an electrical redistribution layer extending in a direction parallel to the main surface of the semiconductor chip and configured to provide a second electrical connection between the electrical contact of the semiconductor chip and the external connection element. The electrical redistribution layer includes a ground line connected to a ground potential and a signal line configured to carry an electrical signal having a wavelength.