公开(公告)号：US20180297301A1

公开(公告)日：2018-10-18

申请号：US15944549

申请日：2018-04-03

Applicant: Infineon Technologies AG

Inventor： Jayaganasan Narayanasamy ,  Jagen Krishnan ,  Sanjay Kumar Murugan ,  Hong Lim Lee

IPC: B29C70/58 ,  B29C70/78 ,  H01L23/495 ,  H01L23/373 ,  H01L21/48

Abstract: A method for forming a matrix composite layer on a workpiece and a workpiece with a matrix composite layer are disclosed. In an embodiment the method includes forming a wall around a metallic surface such that the wall extends in a vertical direction from a plane formed by the metallic surface, and depositing a filler material in a walled area on the metallic surface. The method further includes depositing a plastic material on the filler material and performing a vacuum treatment of the filler material and the plastic material thereby forming a matrix composite layer disposed on the metallic surface.

公开(公告)号：US10457001B2

公开(公告)日：2019-10-29

申请号：US15944549

申请日：2018-04-03

Applicant: Infineon Technologies AG

Inventor： Jayaganasan Narayanasamy ,  Jagen Krishnan ,  Sanjay Kumar Murugan ,  Hong Lim Lee

IPC: B29C70/58 ,  B29C70/78 ,  H01L23/495 ,  H01L21/48 ,  H01L23/373 ,  H01L23/42 ,  H01L23/433 ,  B29L31/34 ,  B29K509/04

Abstract: A method for forming a matrix composite layer on a workpiece and a workpiece with a matrix composite layer are disclosed. In an embodiment the method includes forming a wall around a metallic surface such that the wall extends in a vertical direction from a plane formed by the metallic surface, and depositing a filler material in a walled area on the metallic surface. The method further includes depositing a plastic material on the filler material and performing a vacuum treatment of the filler material and the plastic material thereby forming a matrix composite layer disposed on the metallic surface.