公开(公告)号：US09852918B2

公开(公告)日：2017-12-26

申请号：US14835750

申请日：2015-08-26

Applicant: Infineon Technologies AG

Inventor： Peh Hean Teh ,  Jagen Krishnan ,  Swee Kah Lee ,  Poh Cheng Lim ,  Joachim Mahler ,  Chew Theng Tai ,  Yik Yee Tan ,  Soon Lock Goh

IPC: H01L23/29 ,  H01L21/3105 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  C09J163/00

CPC classification number: H01L21/3105 ,  C09J163/00 ,  H01L21/56 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49513 ,  H01L23/49548 ,  H01L23/49555 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8392 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, an encapsulant at least partially encapsulating the carrier and the at least one electronic chip, and a plurality of capsules in the encapsulant, wherein the capsules comprise a core comprising an additive and comprise a shell, in particular a crackable shell, enclosing the core.

公开(公告)号：US10457001B2

公开(公告)日：2019-10-29

申请号：US15944549

申请日：2018-04-03

Applicant: Infineon Technologies AG

Inventor： Jayaganasan Narayanasamy ,  Jagen Krishnan ,  Sanjay Kumar Murugan ,  Hong Lim Lee

IPC: B29C70/58 ,  B29C70/78 ,  H01L23/495 ,  H01L21/48 ,  H01L23/373 ,  H01L23/42 ,  H01L23/433 ,  B29L31/34 ,  B29K509/04

Abstract: A method for forming a matrix composite layer on a workpiece and a workpiece with a matrix composite layer are disclosed. In an embodiment the method includes forming a wall around a metallic surface such that the wall extends in a vertical direction from a plane formed by the metallic surface, and depositing a filler material in a walled area on the metallic surface. The method further includes depositing a plastic material on the filler material and performing a vacuum treatment of the filler material and the plastic material thereby forming a matrix composite layer disposed on the metallic surface.

公开(公告)号：US10096508B2

公开(公告)日：2018-10-09

申请号：US14826223

申请日：2015-08-14

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Ronald Paramio Joves ,  Thanabal Ganesh Kunamani ,  Kuang Ming Lee ,  Avelino Oliveros Sumagpoa ,  Kian Heong Tan ,  Nestor Vergara Bicomong ,  Jagen Krishnan ,  Soon Hock Tong

IPC: B32B38/10 ,  H01L21/683 ,  B25J11/00 ,  B32B37/00 ,  H01L21/67 ,  B32B43/00

Abstract: In various embodiments, an assembly for handling a semiconductor die is provided. The assembly may include a carrier with a surface. The assembly may also include an adhesive tape fixed to the surface of the carrier. The adhesive tape may be configured to adhere to the semiconductor die. The adhesive tape may include adhesive, the adhesion of which can be reduced by means of electromagnetic waves. The assembly may further include an electromagnetic source configured to apply electromagnetic waves to the adhesive tape to reduce adhesion of the adhesive tape to the semiconductor die. The assembly may additionally include a die pick-up component configured to pick up the semiconductor die from the adhesive tape.

公开(公告)号：US20160064298A1

公开(公告)日：2016-03-03

申请号：US14835750

申请日：2015-08-26

Applicant: Infineon Technologies AG

Inventor： Peh Hean TEH ,  Jagen Krishnan ,  Swee Kah Lee ,  Poh Cheng Lim ,  Joachim Mahler ,  Chew Theng Tai ,  Yik Yee Tan ,  Soon Lock Goh

IPC: H01L23/29 ,  H01L21/3105 ,  H01L23/00 ,  H01L21/56 ,  H01L23/495 ,  H01L23/31

CPC classification number: H01L21/3105 ,  C09J163/00 ,  H01L21/56 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49513 ,  H01L23/49548 ,  H01L23/49555 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8392 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, an encapsulant at least partially encapsulating the carrier and the at least one electronic chip, and a plurality of capsules in the encapsulant, wherein the capsules comprise a core comprising an additive and comprise a shell, in particular a crackable shell, enclosing the core.

Abstract translation: 一种电子设备，包括具有安装表面的载体，安装在所述安装表面上的至少一个电子芯片，至少部分地封装所述载体和所述至少一个电子芯片的密封剂以及所述密封剂中的多个胶囊，其中所述胶囊 包括包含添加剂的芯，并且包括封装芯的壳，特别是可裂纹壳。

公开(公告)号：US20200020607A1

公开(公告)日：2020-01-16

申请号：US16504692

申请日：2019-07-08

Applicant: Infineon Technologies AG

Inventor： Syahir Abd Hamid ,  Jagen Krishnan ,  Mian Mian Lam ,  Jayaganasan Narayanasamy ,  Fabian Schnoy ,  Thomas Stoek ,  Christian Stuempfl

IPC: H01L23/373 ,  H01L23/495 ,  H01L23/31 ,  H01L23/367 ,  H01L21/56 ,  H01L21/48

Abstract: A method of forming a semiconductor device includes providing a semiconductor package comprising an electrically insulating mold compound body, a semiconductor die that is encapsulated by the mold compound body, a plurality of electrically conductive leads that each protrude out of the mold compound body, and a metal heat slug, the metal heat slug comprising a rear surface that is exposed from the mold compound body, coating outer portions of the leads that are exposed from the mold compound body with a metal coating, and after completing the coating of the outer portions of the leads, providing a planar metallic heat sink interface surface on the semiconductor device which is exposed from the mold compound body, and substantially devoid of the metal coating.

公开(公告)号：US20180297301A1

公开(公告)日：2018-10-18

申请号：US15944549

申请日：2018-04-03

Applicant: Infineon Technologies AG

Inventor： Jayaganasan Narayanasamy ,  Jagen Krishnan ,  Sanjay Kumar Murugan ,  Hong Lim Lee

IPC: B29C70/58 ,  B29C70/78 ,  H01L23/495 ,  H01L23/373 ,  H01L21/48

Abstract: A method for forming a matrix composite layer on a workpiece and a workpiece with a matrix composite layer are disclosed. In an embodiment the method includes forming a wall around a metallic surface such that the wall extends in a vertical direction from a plane formed by the metallic surface, and depositing a filler material in a walled area on the metallic surface. The method further includes depositing a plastic material on the filler material and performing a vacuum treatment of the filler material and the plastic material thereby forming a matrix composite layer disposed on the metallic surface.

公开(公告)号：US10651109B2

公开(公告)日：2020-05-12

申请号：US16504692

申请日：2019-07-08

Applicant: Infineon Technologies AG

Inventor： Syahir Abd Hamid ,  Jagen Krishnan ,  Mian Mian Lam ,  Jayaganasan Narayanasamy ,  Fabian Schnoy ,  Thomas Stoek ,  Christian Stuempfl

IPC: H01L23/373 ,  H01L23/495 ,  H01L21/48 ,  H01L23/367 ,  H01L21/56 ,  H01L23/31

Abstract: A method of forming a semiconductor device includes providing a semiconductor package comprising an electrically insulating mold compound body, a semiconductor die that is encapsulated by the mold compound body, a plurality of electrically conductive leads that each protrude out of the mold compound body, and a metal heat slug, the metal heat slug comprising a rear surface that is exposed from the mold compound body, coating outer portions of the leads that are exposed from the mold compound body with a metal coating, and after completing the coating of the outer portions of the leads, providing a planar metallic heat sink interface surface on the semiconductor device which is exposed from the mold compound body, and substantially devoid of the metal coating.

公开(公告)号：US20200020621A1

公开(公告)日：2020-01-16

申请号：US16036354

申请日：2018-07-16

Applicant: Infineon Technologies AG

Inventor： Syahir Abd Hamid ,  Jagen Krishnan ,  Jayaganasan Narayanasamy

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/31 ,  C25D7/12 ,  C25D5/02

Abstract: A semiconductor package having an electrically insulating mold compound body, a metal heat slug and a plurality of electrically conductive leads is provided. The heat slug has a rear surface that is exposed from the mold compound body and a die attach surface opposite the rear surface and to which a semiconductor die is mounted. each of the leads have outer portions that are exposed from the mold compound body. The outer portions of the leads are coated with a metal coating. After completing the coating of the outer portions of the leads, a planar metallic heat sink interface surface is provided on the semiconductor device. The planar metallic heat sink interface surface is exposed from the mold compound body, thermally coupled to the semiconductor die via the heat slug, and substantially devoid of the metal coating.

公开(公告)号：US09540539B2

公开(公告)日：2017-01-10

申请号：US14287231

申请日：2014-05-27

Applicant: Infineon Technologies AG

Inventor： Swee Kah Lee ,  Joachim Mahler ,  Chew Theng Tai ,  Yik Yee Tan ,  Soon Lock Goh ,  Poh Cheng Lim ,  Jagen Krishnan ,  Peh Hean Teh

IPC: C09D179/04 ,  H01L23/29 ,  C09D5/08 ,  C09D163/00 ,  H01L21/56 ,  C08G14/06 ,  C09D161/34

CPC classification number: C09D179/04 ,  C08G14/06 ,  C09D5/002 ,  C09D5/08 ,  C09D161/34 ,  C09D163/00 ,  H01L21/565 ,  H01L23/296 ,  H01L23/3142 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  C08K5/544 ,  C08L63/00

Abstract: A primer composition is provided. The primer composition includes at least one bi- or multi-functional benzoxazine compound; and at least one compound including a functional group having affinity for a metallic surface, and a cross-linkable group. A method of forming a primer layer on a semiconductor device, and a method of encapsulating a semiconductor device are also provided.

Abstract translation: 提供底漆组合物。 底漆组合物包括至少一种双官能或多官能苯并恶嗪化合物; 和至少一种包含对金属表面具有亲和性的官能团的化合物和可交联基团。 还提供了在半导体器件上形成底漆层的方法以及封装半导体器件的方法。