公开(公告)号：US20220278085A1

公开(公告)日：2022-09-01

申请号：US17677055

申请日：2022-02-22

Applicant: Infineon Technologies AG

Inventor： Chau Fatt CHIANG ,  Paul Armand Asentista CALO ,  Chan Lam CHA ,  Kok Yau CHUA ,  Chee Hong LEE ,  Swee Kah LEE ,  Theng Chao LONG ,  Jayaganasan NARAYANASAMY ,  Khay Chwan Andrew SAW

IPC: H01L25/16 ,  H01L23/13 ,  H01L21/48 ,  H01L25/00 ,  H01L25/10 ,  H01L23/498

Abstract: The method for fabricating an electrical module is disclosed. In one example, the method includes providing a bottom unit comprising a plateable encapsulant. Selective areas of the bottom unit are activated thereby turning them into electrically conductive regions. At least one electrical device comprising external contact elements is provided. The method includes placing the electrical device on the bottom unit so that the external contact elements are positioned above at least a first subset of the electrically conductive regions, and performing a plating process on the electrically conductive regions for generating plated regions and for electrically connecting the external contact elements with at least a first subset of the plated regions.