公开(公告)号：US11274984B2

公开(公告)日：2022-03-15

申请号：US16890461

申请日：2020-06-02

Applicant: Infineon Technologies AG

Inventor： Chau Fatt Chiang ,  Paul Armand Asentista Calo ,  Chan Lam Cha ,  Kok Yau Chua ,  Jo Ean Chye ,  Chee Hong Lee ,  Swee Kah Lee ,  Theng Chao Long ,  Jayaganasan Narayanasamy ,  Khay Chwan Saw

IPC: G01L9/00 ,  G01L19/14

Abstract: A pressure sensor includes a lidless structure defining an internal chamber for a sealed environment and presenting an aperture; a chip including a membrane deformable on the basis of external pressure, the chip being mounted outside the lidless structure in correspondence to the aperture so that the membrane closes the sealed environment; and a circuitry configured to provide a pressure measurement information based on the deformation of the membrane.

公开(公告)号：US20210025774A1

公开(公告)日：2021-01-28

申请号：US16890461

申请日：2020-06-02

Applicant: Infineon Technologies AG

Inventor： Chau Fatt Chiang ,  Paul Armand Asentista Calo ,  Chan Lam Cha ,  Kok Yau Chua ,  Jo Ean Chye ,  Chee Hong Lee ,  Swee Kah Lee ,  Theng Chao Long ,  Jayaganasan Narayanasamy ,  Khay Chwan Saw

IPC: G01L9/00 ,  G01L19/14

Abstract: A pressure sensor includes a lidless structure defining an internal chamber for a sealed environment and presenting an aperture; a chip including a membrane deformable on the basis of external pressure, the chip being mounted outside the lidless structure in correspondence to the aperture so that the membrane closes the sealed environment; and a circuitry configured to provide a pressure measurement information based on the deformation of the membrane.