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公开(公告)号：US20150255407A1
公开(公告)日：2015-09-10
申请号：US14201260
申请日：2014-03-07
Applicant: Infineon Technologies AG
Inventor： Christoph Glacer , Alfons Dehe , John Brueckner
CPC classification number: H01L22/12 , B81C99/004 , G01N3/02 , G01N3/08 , G01N2203/0017 , G01N2203/0286 , G01N2203/0298 , H01L21/0217 , H01L21/32055 , H01L22/32 , H01L23/564 , H01L2924/0002 , H01L2924/00
Abstract: According to an embodiment, a micro-fabricated test structure includes a structure mechanically coupled between two rigid anchors and disposed above a substrate. The structure is released from the substrate and includes a test layer mechanically coupled between the two rigid anchors. The test layer includes a first region having a first cross-sectional area and a constricted region having a second cross-sectional area smaller than the first cross-sectional area. The structure also includes a first tensile stressed layer disposed on a surface of the test layer adjacent the first region.
Abstract translation: 根据一个实施例，微型制造的测试结构包括机械耦合在两个刚性锚固件之间并且设置在基板上方的结构。 该结构从衬底上释放并且包括机械耦合在两个刚性锚固件之间的测试层。 测试层包括具有第一横截面积的第一区域和具有小于第一横截面积的第二横截面积的收缩区域。 该结构还包括设置在与第一区域相邻的测试层的表面上的第一拉伸应力层。
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公开(公告)号：US20170243793A1
公开(公告)日：2017-08-24
申请号：US15589594
申请日：2017-05-08
Applicant: Infineon Technologies AG
Inventor： Christoph Glacer , Alfons Dehe , John Brueckner
IPC: H01L21/66 , G01N3/08 , B81C99/00 , H01L21/02 , H01L21/3205
CPC classification number: H01L22/12 , B81C99/004 , G01N3/02 , G01N3/08 , G01N2203/0017 , G01N2203/0286 , G01N2203/0298 , H01L21/0217 , H01L21/32055 , H01L22/32 , H01L23/564 , H01L2924/0002 , H01L2924/00
Abstract: According to an embodiment, a micro-fabricated test structure includes a structure mechanically coupled between two rigid anchors and disposed above a substrate. The structure is released from the substrate and includes a test layer mechanically coupled between the two rigid anchors. The test layer includes a first region having a first cross-sectional area and a constricted region having a second cross-sectional area smaller than the first cross-sectional area. The structure also includes a first tensile stressed layer disposed on a surface of the test layer adjacent the first region.
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公开(公告)号：US10109536B2
公开(公告)日：2018-10-23
申请号：US15589594
申请日：2017-05-08
Applicant: Infineon Technologies AG
Inventor： Christoph Glacer , Alfons Dehe , John Brueckner
IPC: H01L21/66 , H01L21/02 , H01L21/3205 , B81C99/00 , G01N3/08
Abstract: According to an embodiment, a micro-fabricated test structure includes a structure mechanically coupled between two rigid anchors and disposed above a substrate. The structure is released from the substrate and includes a test layer mechanically coupled between the two rigid anchors. The test layer includes a first region having a first cross-sectional area and a constricted region having a second cross-sectional area smaller than the first cross-sectional area. The structure also includes a first tensile stressed layer disposed on a surface of the test layer adjacent the first region.
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公开(公告)号：US09679856B2
公开(公告)日：2017-06-13
申请号：US14201260
申请日：2014-03-07
Applicant: Infineon Technologies AG
Inventor： Christoph Glacer , Alfons Dehe , John Brueckner
CPC classification number: H01L22/12 , B81C99/004 , G01N3/02 , G01N3/08 , G01N2203/0017 , G01N2203/0286 , G01N2203/0298 , H01L21/0217 , H01L21/32055 , H01L22/32 , H01L23/564 , H01L2924/0002 , H01L2924/00
Abstract: According to an embodiment, a micro-fabricated test structure includes a structure mechanically coupled between two rigid anchors and disposed above a substrate. The structure is released from the substrate and includes a test layer mechanically coupled between the two rigid anchors. The test layer includes a first region having a first cross-sectional area and a constricted region having a second cross-sectional area smaller than the first cross-sectional area. The structure also includes a first tensile stressed layer disposed on a surface of the test layer adjacent the first region.
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