公开(公告)号：US20220415732A1

公开(公告)日：2022-12-29

申请号：US17840971

申请日：2022-06-15

Applicant: Infineon Technologies AG

Inventor： Christoph Liebl ,  Stefan Schwab ,  Adrian Lis ,  Michael Ledutke ,  Lisa Aschenbrenner

IPC: H01L23/057 ,  H01L23/31 ,  H01L23/373

Abstract: A semiconductor module includes: a chip carrier having a first side and a second, opposite side; a semiconductor chip arranged on the first side of the chip carrier; an encapsulation body that encapsulates the semiconductor chip; and at least two external contacts made of a metal or an alloy and arranged next to each other, which are electrically and mechanically connected to the first side of the first chip carrier and protrude laterally out of the encapsulation body. At least one of the external contacts has at least one wing arranged within the encapsulation body and located opposite the other external contact. The wing includes one or more cutouts that are filled with the encapsulation material of the encapsulation body.