公开(公告)号：US20200005957A1

公开(公告)日：2020-01-02

申请号：US16569676

申请日：2019-09-13

Applicant: Infineon Technologies AG

Inventor： Markus BINA ,  Hans-Joachim Schulze ,  Werner Schustereder

IPC: G21G1/06 ,  H01L21/261 ,  C30B31/20

Abstract: An apparatus for processing a plurality of semiconductor wafers, the apparatus including a spallation chamber, a neutron producing material mounted in the spallation chamber, a neutron moderator, and an irradiation chamber coupled to the spallation chamber, wherein the neutron moderator is disposed between the spallation chamber and the irradiation chamber, wherein the irradiation chamber is configured to accommodate the plurality of semiconductor wafers, wherein each of the plurality of semiconductor wafers has a first surface and a second surface opposite the first surface, wherein the plurality of semiconductor wafers are positioned so that a first surface of one semiconductor wafer faces a second surface of another semiconductor wafer.