公开(公告)号：US10229352B2

公开(公告)日：2019-03-12

申请号：US14549578

申请日：2014-11-21

Applicant: Infineon Technologies AG

Inventor： Martin Klimke ,  Berndt Gammel ,  Frank Pueschner ,  Peter Stampka

IPC: G06K19/06 ,  H01L29/18 ,  H01L33/00 ,  G06K19/073 ,  G06K19/077

Abstract: One embodiment describes a chip arrangement having a chip carrier; a chip which is arranged in or on the chip carrier; a light sensor arrangement; a transparent layer which covers the light sensor arrangement, the light sensor arrangement being set up to determine a light pattern of light received by the light sensor arrangement from outside the chip arrangement through the transparent layer; and a test circuit which is set up to check whether the light pattern matches a reference light pattern and to output a signal on the basis of the result of the check.