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公开(公告)号：US09444331B2
公开(公告)日：2016-09-13
申请号：US13953301
申请日：2013-07-29
Applicant: Infineon Technologies AG
Inventor： Andrea Carletti , Mathias Kiele-Dunsche
Abstract: In accordance with an embodiment, a circuit includes a switch coupled between a first reference terminal and a first output terminal, an inductive element coupled between an input terminal and a second output terminal, and a diode coupled between the first output terminal and the input terminal. The circuit further includes a controller coupled to a control terminal of the switch. The controller is configured to determine a switching signal based on an output signal at the second output terminal and provide the switching signal to the control terminal of the switch.
Abstract translation: 根据实施例，电路包括耦合在第一参考端子和第一输出端子之间的开关，耦合在输入端子和第二输出端子之间的电感元件以及耦合在第一输出端子和输入端子之间的二极管 。 电路还包括耦合到开关的控制端的控制器。 控制器被配置为基于第二输出端子处的输出信号来确定开关信号，并将开关信号提供给开关的控制端子。
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公开(公告)号：US10784183B2
公开(公告)日：2020-09-22
申请号：US16207001
申请日：2018-11-30
Applicant: Infineon Technologies AG
Inventor： Pawan Garg , Mathias Kiele-Dunsche , Tomas Manuel Reiter , Christopher Roemmelmayer
IPC: H01L23/40 , H01L23/498 , H01L21/52 , H01L23/544
Abstract: A semiconductor package includes a semiconductor module, a first package extension frame, a second package extension frame, and a plurality of fasteners. The semiconductor module includes a first side surface, a second side surface, a first major surface, and a second major surface on an opposite side of the semiconductor module from the first major surface. The first package extension frame is configured to attach to the first side surface. The second package extension frame is configured to attach to the second side surface. The plurality of fasteners are configured to mechanically couple the first package extension frame and the second package extension frame to one or more of a circuit board arranged on the first major surface and/or a heat sink arranged on the second major surface.
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公开(公告)号：US20200176351A1
公开(公告)日：2020-06-04
申请号：US16207001
申请日：2018-11-30
Applicant: Infineon Technologies AG
Inventor： Pawan Garg , Mathias Kiele-Dunsche , Tomas Manuel Reiter , Christopher Roemmelmayer
IPC: H01L23/40 , H01L23/498 , H01L23/544 , H01L21/52
Abstract: A semiconductor package includes a semiconductor module, a first package extension frame, a second package extension frame, and a plurality of fasteners. The semiconductor module includes a first side surface, a second side surface, a first major surface, and a second major surface on an opposite side of the semiconductor module from the first major surface. The first package extension frame is configured to attach to the first side surface. The second package extension frame is configured to attach to the second side surface. The plurality of fasteners are configured to mechanically couple the first package extension frame and the second package extension frame to one or more of a circuit board arranged on the first major surface and/or a heat sink arranged on the second major surface.
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公开(公告)号：US20150028836A1
公开(公告)日：2015-01-29
申请号：US13953301
申请日：2013-07-29
Applicant: Infineon Technologies AG
Inventor： Andrea Carletti , Mathias Kiele-Dunsche
Abstract: In accordance with an embodiment, a circuit includes a switch coupled between a first reference terminal and a first output terminal, an inductive element coupled between an input terminal and a second output terminal, and a diode coupled between the first output terminal and the input terminal. The circuit further includes a controller coupled to a control terminal of the switch. The controller is configured to determine a switching signal based on an output signal at the second output terminal and provide the switching signal to the control terminal of the switch.
Abstract translation: 根据实施例，电路包括耦合在第一参考端子和第一输出端子之间的开关，耦合在输入端子和第二输出端子之间的电感元件以及耦合在第一输出端子和输入端子之间的二极管 。 电路还包括耦合到开关的控制端的控制器。 控制器被配置为基于第二输出端子处的输出信号来确定开关信号，并将开关信号提供给开关的控制端子。
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