公开(公告)号：US10784183B2

公开(公告)日：2020-09-22

申请号：US16207001

申请日：2018-11-30

Applicant: Infineon Technologies AG

Inventor： Pawan Garg ,  Mathias Kiele-Dunsche ,  Tomas Manuel Reiter ,  Christopher Roemmelmayer

IPC: H01L23/40 ,  H01L23/498 ,  H01L21/52 ,  H01L23/544

Abstract: A semiconductor package includes a semiconductor module, a first package extension frame, a second package extension frame, and a plurality of fasteners. The semiconductor module includes a first side surface, a second side surface, a first major surface, and a second major surface on an opposite side of the semiconductor module from the first major surface. The first package extension frame is configured to attach to the first side surface. The second package extension frame is configured to attach to the second side surface. The plurality of fasteners are configured to mechanically couple the first package extension frame and the second package extension frame to one or more of a circuit board arranged on the first major surface and/or a heat sink arranged on the second major surface.

公开(公告)号：US20200295651A1

公开(公告)日：2020-09-17

申请号：US16299093

申请日：2019-03-11

Applicant: Infineon Technologies AG

Inventor： Pawan Garg ,  Stefan Schumi

IPC: H02M1/15 ,  H02M3/158

Abstract: A controller circuit for a switch-mode power supply (SMPS). The controller circuit is configured to generate, with a plurality of phases, a combined output current at a supply node to supply a load, determine a ripple shaping current complimentary to an estimated ripple at the combined output current using a number of active phases of the plurality of phases that generate the combined output current, and generate, with an auxiliary phase, the ripple shaping current at the supply node to reduce ripple occurring at the combined output current.

公开(公告)号：US10855166B2

公开(公告)日：2020-12-01

申请号：US16299093

申请日：2019-03-11

Applicant: Infineon Technologies AG

Inventor： Pawan Garg ,  Stefan Schumi

IPC: H02M1/15 ,  H02M3/158 ,  H02M1/00 ,  H02M3/156

Abstract: A controller circuit for a switch-mode power supply (SMPS). The controller circuit is configured to generate, with a plurality of phases, a combined output current at a supply node to supply a load, determine a ripple shaping current complimentary to an estimated ripple at the combined output current using a number of active phases of the plurality of phases that generate the combined output current, and generate, with an auxiliary phase, the ripple shaping current at the supply node to reduce ripple occurring at the combined output current.

公开(公告)号：US20200176351A1

公开(公告)日：2020-06-04

申请号：US16207001

申请日：2018-11-30

Applicant: Infineon Technologies AG

Inventor： Pawan Garg ,  Mathias Kiele-Dunsche ,  Tomas Manuel Reiter ,  Christopher Roemmelmayer

IPC: H01L23/40 ,  H01L23/498 ,  H01L23/544 ,  H01L21/52

Abstract: A semiconductor package includes a semiconductor module, a first package extension frame, a second package extension frame, and a plurality of fasteners. The semiconductor module includes a first side surface, a second side surface, a first major surface, and a second major surface on an opposite side of the semiconductor module from the first major surface. The first package extension frame is configured to attach to the first side surface. The second package extension frame is configured to attach to the second side surface. The plurality of fasteners are configured to mechanically couple the first package extension frame and the second package extension frame to one or more of a circuit board arranged on the first major surface and/or a heat sink arranged on the second major surface.