Memory cell, memory cell configuration and fabrication method
    1.
    发明申请
    Memory cell, memory cell configuration and fabrication method 有权
    存储单元,存储单元配置和制造方法

    公开(公告)号:US20030015752A1

    公开(公告)日:2003-01-23

    申请号:US09927573

    申请日:2001-08-09

    CPC classification number: H01L27/11568 H01L27/115 H01L29/66833 H01L29/792

    Abstract: Each memory cell is a memory transistor which is provided on a top side of a semiconductor body and has a gate electrode which is arranged in a trench located between a source region and a drain region that are formed in the semiconductor material. The gate electrode is separated from the semiconductor material by a dielectric material. At least between the source region and the gate electrode and between the drain region and the gate electrode, there is an oxide-nitride-oxide layer sequence. The layer sequence is provided for the purpose of trapping charge carriers at the source and the drain.

    Abstract translation: 每个存储单元是存储晶体管,其设置在半导体本体的顶侧,并且具有布置在形成于半导体材料中的源极区域和漏极区域之间的沟槽中的栅电极。 栅电极通过介电材料与半导体材料分离。 至少在源极区域和栅极电极之间以及漏极区域和栅极电极之间,存在氧化物 - 氮化物 - 氧化物层序列。 层序列是为了在源极和漏极处俘获电荷载体而提供的。

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