公开(公告)号：US20170317036A1

公开(公告)日：2017-11-02

申请号：US15582646

申请日：2017-04-29

Applicant: Infineon Technologies AG

Inventor： Edward MYERS ,  Thomas BEMMERL ,  Melissa STAHL

IPC: H01L23/00 ,  H01L21/48 ,  H01L23/495 ,  H01L23/31 ,  H01L21/56

Abstract: A package comprising an electronic chip with at least one electric contact structure, an electrically conductive chip carrier having at least one coupling cavity, and a coupling structure located at least partially in the at least one coupling cavity and electrically contacting the at least one electric contact structure with the chip carrier.