公开(公告)号：US20180233438A1

公开(公告)日：2018-08-16

申请号：US15893754

申请日：2018-02-12

Applicant: Infineon Technologies AG

Inventor： Thomas BEMMERL ,  Azlina KASSIM ,  Nurfarena OTHMAN

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49568 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L2224/16245 ,  H01L2924/18161

Abstract: A leadframe, that is to be incorporated into a semiconductor housing is provided. The leadframe may include a first die pad, a second die pad and a plurality of contact pads. A lower surface of the contact pads and a lower surface of the first die pad are arranged in a first plane. An upper surface of the second die pad is arranged in a second plane distant from the first plane by an overall thickness of the semiconductor package.

公开(公告)号：US20230420317A1

公开(公告)日：2023-12-28

申请号：US18211898

申请日：2023-06-20

Applicant: Infineon Technologies AG

Inventor： Michael STADLER ,  Thomas BEMMERL

IPC: H01L23/16 ,  H01L23/495 ,  H01L23/31 ,  H01L21/56 ,  H05K3/34 ,  B23K1/00

CPC classification number: H01L23/16 ,  H01L23/49575 ,  H01L23/3107 ,  H01L23/49503 ,  H01L21/56 ,  H05K3/3431 ,  B23K1/0016 ,  B23K2101/42

Abstract: An electronic device and method is disclosed. In one example, the electronic device includes a solderable surface and at least one surface opening arranged in the solderable surface. The electronic device further includes an encapsulation material, encapsulating at least one electronic component of the electronic device, and at least one vent opening arranged in an area of the surface opening and extending through the encapsulation material.

公开(公告)号：US20170317036A1

公开(公告)日：2017-11-02

申请号：US15582646

申请日：2017-04-29

Applicant: Infineon Technologies AG

Inventor： Edward MYERS ,  Thomas BEMMERL ,  Melissa STAHL

IPC: H01L23/00 ,  H01L21/48 ,  H01L23/495 ,  H01L23/31 ,  H01L21/56

Abstract: A package comprising an electronic chip with at least one electric contact structure, an electrically conductive chip carrier having at least one coupling cavity, and a coupling structure located at least partially in the at least one coupling cavity and electrically contacting the at least one electric contact structure with the chip carrier.

公开(公告)号：US20240347427A1

公开(公告)日：2024-10-17

申请号：US18598163

申请日：2024-03-07

Applicant: Infineon Technologies AG

Inventor： Edward FÜRGUT ,  Teck Sim LEE ,  Guey Yong CHEE ,  Thai Kee GAN ,  Thomas BEMMERL ,  Markus FINK

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/07

CPC classification number: H01L23/49555 ,  H01L23/49537 ,  H01L23/49562 ,  H01L24/08 ,  H01L25/072 ,  H01L2224/08221 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091

Abstract: A leadframe is disclosed. In one example, the leadframe comprises a die pad and a first lead comprising an inner portion and an external portion. The first lead comprises at least one elevation portion extending over a predetermined length in a longitudinal or lateral direction of the first lead. The external portion is configured to be used for external electrical connection. In another example, a semiconductor package having a leadframe is disclosed.

公开(公告)号：US20220165687A1

公开(公告)日：2022-05-26

申请号：US17502084

申请日：2021-10-15

Applicant: Infineon Technologies AG

Inventor： Thorsten MEYER ,  Thomas BEMMERL ,  Martin GRUBER ,  Martin Richard NIESSNER

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/56 ,  H01L21/48

Abstract: A package is disclosed. In one example, the package comprises a carrier, an electronic component mounted on the carrier, an encapsulant encapsulating at least part of the electronic component and at least part of the carrier and having a bottom side at a first vertical level. At least one lead is electrically coupled with the electronic component and comprising a first lead portion being encapsulated in the encapsulant and a second lead portion extending out of the encapsulant at the bottom side of the encapsulant. A functional structure at the bottom side extends up to a second vertical level different from the first vertical level.