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公开(公告)号：US20220069203A1
公开(公告)日：2022-03-03
申请号：US17445858
申请日：2021-08-25
Applicant: Infineon Technologies AG
Inventor： Momtchil STAVREV , Dirk MEINHOLD
Abstract: A semiconductor die is proposed, wherein the semiconductor die comprises a microelectronic section and a sensor section. The microelectronic section comprises an integrated circuit. The sensor section adjoins an edge of the semiconductor die. A sensor is also proposed, which comprises such a semiconductor die.
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