公开(公告)号：US20240387305A1

公开(公告)日：2024-11-21

申请号：US18647712

申请日：2024-04-26

Applicant: Infineon Technologies AG

Inventor： Meng How Chong ,  Muhammad Safie Rosli ,  Michael Reyes Godoy ,  Ke Yan Tean

IPC: H01L23/29 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495

Abstract: A semiconductor package includes: a die pad having opposing first and second sides and lateral sides connecting the first and second sides; at least one semiconductor die arranged over the first side; an encapsulation including a first dielectric material and encapsulating the semiconductor die, the second side of the die pad being at least partially exposed from the encapsulation; and a contiguous isolation structure including a second dielectric material different from the first dielectric material and covering the second side of the die pad. The encapsulation includes at least one first trench arranged along at least a part of a contour of the second side of the die pad. The second side of the die pad includes at least one second trench arranged along at least a part of the contour of the second side of the die pad. The trenches are filled by the contiguous isolation structure.