公开(公告)号：US20220115245A1

公开(公告)日：2022-04-14

申请号：US17492865

申请日：2021-10-04

Applicant: Infineon Technologies AG

Inventor： Jayaganasan Narayanasamy ,  Syahir Abd Hamid ,  Meng How Chong ,  Michael Reyes Godoy ,  Chee Ming Lam ,  Adbul Rahman Mohamed ,  Sanjay Kumar Murugan ,  Thomas Stoek

IPC: H01L21/48 ,  H01L21/56 ,  H01L23/495 ,  H01L23/31

Abstract: A method for fabricating a power semiconductor package includes: providing a leadframe having a die pad and a frame, wherein the die pad is connected to the frame by at least one tie bar; attaching a semiconductor die to the die pad; laser cutting through the at least one tie bar, thereby forming a cut surface; and after the laser cutting, molding over the die pad and the semiconductor die, wherein the cut surface is completely covered by molding compound.

公开(公告)号：US11362023B2

公开(公告)日：2022-06-14

申请号：US16510448

申请日：2019-07-12

Applicant: Infineon Technologies AG

Inventor： Jayaganasan Narayanasamy ,  Meng How Chong ,  Elmer Senorin Holgado ,  Chee Ming Lam ,  Sanjay Kumar Murugan ,  Arivindran Navaretnasinggam ,  Kai Yang Tan ,  Lee Shuang Wang

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

Abstract: A lead frame includes a die pad, a first lead extending away from the die pad, a peripheral structure mechanically connected to the first lead and the die pad, and a first groove in an outer surface of the first lead. The first groove extends longitudinally along the first lead away from the die pad.

公开(公告)号：US20240387305A1

公开(公告)日：2024-11-21

申请号：US18647712

申请日：2024-04-26

Applicant: Infineon Technologies AG

Inventor： Meng How Chong ,  Muhammad Safie Rosli ,  Michael Reyes Godoy ,  Ke Yan Tean

IPC: H01L23/29 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495

Abstract: A semiconductor package includes: a die pad having opposing first and second sides and lateral sides connecting the first and second sides; at least one semiconductor die arranged over the first side; an encapsulation including a first dielectric material and encapsulating the semiconductor die, the second side of the die pad being at least partially exposed from the encapsulation; and a contiguous isolation structure including a second dielectric material different from the first dielectric material and covering the second side of the die pad. The encapsulation includes at least one first trench arranged along at least a part of a contour of the second side of the die pad. The second side of the die pad includes at least one second trench arranged along at least a part of the contour of the second side of the die pad. The trenches are filled by the contiguous isolation structure.

公开(公告)号：US20210013135A1

公开(公告)日：2021-01-14

申请号：US16510448

申请日：2019-07-12

Applicant: Infineon Technologies AG

Inventor： Jayaganasan Narayanasamy ,  Meng How Chong ,  Elmer Senorin Holgado ,  Chee Ming Lam ,  Sanjay Kumar Murugan ,  Arivindran Navaretnasinggam ,  Kai Yang Tan ,  Lee Shuang Wang

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: A lead frame includes a die pad, a first lead extending away from the die pad, a peripheral structure mechanically connected to the first lead and the die pad, and a first groove in an outer surface of the first lead. The first groove extends longitudinally along the first lead away from the die pad.