公开(公告)号：US20240186152A1

公开(公告)日：2024-06-06

申请号：US18388581

申请日：2023-11-10

Applicant: Infineon Technologies AG

Inventor： Roslie Saini BAKAR ,  Hock Heng CHONG ,  Swee Kah LEE ,  Wei Wei YONG

IPC: H01L21/56 ,  H01L23/31

CPC classification number: H01L21/561 ,  H01L21/568 ,  H01L23/3185

Abstract: A method of processing chips is disclosed. In one example, the method comprises encapsulating mutually spaced chips by an encapsulant comprising a locally curable material. The encapsulated chips with the encapsulant are separated into a plurality of encapsulated chip sections by locally curing selectively portions of the encapsulant covering at least a portion of the chips without curing other portions of the encapsulant apart from the encapsulated chip sections.