公开(公告)号：US10727151B2

公开(公告)日：2020-07-28

申请号：US15605091

申请日：2017-05-25

Applicant: Infineon Technologies AG

Inventor： Liu Chen ,  Teck Sim Lee ,  Jia Yi Wong ,  Wei Han Koo ,  Thomas Stoeck ,  Gilles Delarozee

IPC: H01L23/367 ,  H01L23/492 ,  H01L23/495 ,  H01L21/56 ,  H01L23/433 ,  H01L23/31 ,  H01L23/36 ,  H01L23/498 ,  H01L23/373

Abstract: A semiconductor chip package includes an electrically conducting carrier and a semiconductor chip disposed over the electrically conducting carrier. The semiconductor chip has a first surface facing the electrically conducting carrier and a second surface opposite the first surface. A metal plate has a first surface mechanically connected to the second surface of the semiconductor chip and a second surface opposite the first surface of the metal plate. The metal plate completely overlaps the second surface of the semiconductor chip. The second surface of the metal plate is at least partially exposed at a periphery of the semiconductor chip package.