公开(公告)号：US10155657B2

公开(公告)日：2018-12-18

申请号：US15248651

申请日：2016-08-26

Applicant: Infineon Technologies AG

Inventor： Matthias Steiert ,  Kok Yau Chua ,  Chu Hua Goh ,  Woon Yau Lim ,  Christina Yeong

IPC: B81B7/00 ,  B81C1/00

Abstract: The electronic device comprises a semiconductor chip comprising a first main face, a second main face opposite to the first main face, side faces connecting the first and second main faces, and a sensor element or actuator element disposed at the first main face, and a substrate, wherein the semiconductor chip is disposed above the substrate, the first main face of the semiconductor chip facing the substrate, wherein the substrate comprises a substrate opening, the substrate opening permitting passage of signals to the sensor element or from the actuator element.

公开(公告)号：US20170081175A1

公开(公告)日：2017-03-23

申请号：US15248651

申请日：2016-08-26

Applicant: Infineon Technologies AG

Inventor： Matthias Steiert ,  Kok Yau Chua ,  Chu Hua Goh ,  Woon Yau Lim ,  Christina Yeong

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/007 ,  B81B2201/0264 ,  B81C1/00301 ,  B81C1/00309 ,  B81C2203/0154 ,  H01L2224/16245 ,  H01L2924/1815

Abstract: The electronic device comprises a semiconductor chip comprising a first main face, a second main face opposite to the first main face, side faces connecting the first and second main faces, and a sensor element or actuator element disposed at the first main face, and a substrate, wherein the semiconductor chip is disposed above the substrate, the first main face of the semiconductor chip facing the substrate, wherein the substrate comprises a substrate opening, the substrate opening permitting passage of signals to the sensor element or from the actuator element.