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公开(公告)号：US20170365544A1
公开(公告)日：2017-12-21
申请号：US15624026
申请日：2017-06-15
发明人： Abdul Rahman Mohamed , Chu Hua Goh
IPC分类号： H01L23/495 , H01L23/00
CPC分类号： H01L23/49575 , H01L23/49517 , H01L23/49524 , H01L24/83 , H01L2224/83805 , H01L2924/014
摘要： A method of fabricating a semiconductor device is disclosed. In one aspect, the method includes placing a first semiconductor chip on a carrier with the first main surface of the first semiconductor chip facing the carrier. A first layer of soft solder material is provided between the first main surface and the carrier. Heat is applied during placing so that a temperature at the first layer of soft solder material is equal to or higher than a melting temperature of the first layer of soft solder material. A second layer of soft solder material is provided between the first contact area and the second main surface. Heat is applied during placing so that a temperature at the second layer of soft solder material is equal to or higher than a melting temperature of the second layer of soft solder material. The first and second layers of soft solder material are cooled to solidify the soft solder materials.
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2.发明申请公开(公告)号：US20170081175A1
公开(公告)日：2017-03-23
申请号：US15248651
申请日：2016-08-26
发明人： Matthias Steiert , Kok Yau Chua , Chu Hua Goh , Woon Yau Lim , Christina Yeong
CPC分类号： B81B7/007 , B81B2201/0264 , B81C1/00301 , B81C1/00309 , B81C2203/0154 , H01L2224/16245 , H01L2924/1815
摘要： The electronic device comprises a semiconductor chip comprising a first main face, a second main face opposite to the first main face, side faces connecting the first and second main faces, and a sensor element or actuator element disposed at the first main face, and a substrate, wherein the semiconductor chip is disposed above the substrate, the first main face of the semiconductor chip facing the substrate, wherein the substrate comprises a substrate opening, the substrate opening permitting passage of signals to the sensor element or from the actuator element.
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公开(公告)号：US10325838B2
公开(公告)日：2019-06-18
申请号：US15624026
申请日：2017-06-15
发明人： Abdul Rahman Mohamed , Chu Hua Goh
IPC分类号： H01L23/00 , H01L23/495
摘要： A method of fabricating a semiconductor device is disclosed. In one aspect, the method includes placing a first semiconductor chip on a carrier with the first main surface of the first semiconductor chip facing the carrier. A first layer of soft solder material is provided between the first main surface and the carrier. Heat is applied during placing so that a temperature at the first layer of soft solder material is equal to or higher than a melting temperature of the first layer of soft solder material. A second layer of soft solder material is provided between the first contact area and the second main surface. Heat is applied during placing so that a temperature at the second layer of soft solder material is equal to or higher than a melting temperature of the second layer of soft solder material. The first and second layers of soft solder material are cooled to solidify the soft solder materials.
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公开(公告)号：US10155657B2
公开(公告)日：2018-12-18
申请号：US15248651
申请日：2016-08-26
发明人： Matthias Steiert , Kok Yau Chua , Chu Hua Goh , Woon Yau Lim , Christina Yeong
摘要： The electronic device comprises a semiconductor chip comprising a first main face, a second main face opposite to the first main face, side faces connecting the first and second main faces, and a sensor element or actuator element disposed at the first main face, and a substrate, wherein the semiconductor chip is disposed above the substrate, the first main face of the semiconductor chip facing the substrate, wherein the substrate comprises a substrate opening, the substrate opening permitting passage of signals to the sensor element or from the actuator element.
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