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公开(公告)号:US20130206602A1
公开(公告)日:2013-08-15
申请号:US13370181
申请日:2012-02-09
申请人: Inho LEE , Elissei Iagodkine , Yi Qin , Yu Luo
发明人: Inho LEE , Elissei Iagodkine , Yi Qin , Yu Luo
IPC分类号: C25D3/56
摘要: Tin-silver alloy electroplating baths having certain amine-oxide surfactants and methods of electrodepositing a tin-silver-containing layer using these baths are disclosed. Such electroplating baths are useful to provide tin-silver solder deposits having reduced void formation and improved within-die uniformity.
摘要翻译: 公开了具有某些氧化胺表面活性剂的锡 - 银合金电镀浴和使用这些浴电沉积含锡银层的方法。 这种电镀浴可用于提供具有减小的空隙形成和改进的管芯内均匀性的锡 - 银焊料沉积物。