Abstract:
The present disclosure provides an electronic device including a substrate, a first circuit layer, and a plurality of diodes. The substrate has a plurality of first through holes. The first circuit layer is disposed on the substrate and has a plurality of light through holes. The diodes disposed on the first circuit layer. One of the light through holes is located between two adjacent ones of the diodes, and the light through holes overlap a portion of the plurality of first through holes and do not overlap another portion of the plurality of first through holes in a normal direction of the substrate.
Abstract:
An electronic device is disclosed and includes a substrate, a circuit layer, and a plurality of diodes. The substrate has a plurality of structures. The circuit layer is disposed on the substrate. The diodes are disposed on the circuit layer, wherein a first spacing is defined as a distance between a center point of a first one of the structures and a center point of a second one of the structures, a second spacing is defined as a distance between a center point of a third one of the structures and a center point of a fourth one of the structures, and an absolute value of a difference between the first spacing and the second spacing is less than 0.5 times radius of curvature of the electronic device when the electronic device is bent.
Abstract:
An electronic device includes a first substrate, a first conductive layer, a plurality of first electrode pads, a plurality of first light-emitting units, a plurality of first signal pads and a conductive structure. The first conductive layer is disposed on the first substrate. The first electrode pads are disposed on the first conductive layer. The first light-emitting units overlap and are disposed on the first electrode pads. The first light-emitting units are electrically connected to the first electrode pads respectively. The first signal pads are disposed on the first conductive layer and electrically connected to the first conductive layer. The conductive structure is disposed on the first signal pads, and at least two of the first signal pads are electrically connected to each other through the conductive structure.
Abstract:
An electronic apparatus having a display device including a display panel and a light source. The display panel includes a first substrate and a second substrate disposed oppositely, and a display medium layer disposed therebetween. The light source is disposed adjacent to the display panel. The display panel includes several display units, including a first display unit and a second display unit when light passes through the display medium layer. The second display unit is farther from the light source than the first display unit. It is designed that the second haze value is greater than the first haze value.
Abstract:
The present invention relates to a backlight module, a display comprising thereof and a method for manufacturing a light guiding plate. The backlight module comprising: a housing; a light guiding plate disposed in the housing, and the light guiding plate comprises a light entrance surface, a bottom surface, and a light exit surface; and a light source disposed adjacent the light entrance surface of the light guiding plate, wherein a horizontal cross section of the light exit surface of the light guiding plate has a first curve, and a vertical cross section of the light exit surface of the light guiding plate through any peak of the first curve has a second curve, wherein adjacent peaks of the first curve have a same distance therebetween, and adjacent troughs of the first curve are spaced apart by first distances.
Abstract:
The present disclosure provides an electronic device including a substrate, a plurality of bumps, a plurality of diodes, and a shielding layer. The substrate has a plurality of first through holes. The bumps are disposed on the substrate. The diodes are disposed on the substrate. The shielding layer is disposed on the substrate. One of the bumps is located between two adjacent ones of the diodes in a cross-sectional view, and the shielding layer overlaps at least a portion of the bumps and at least a portion of the first through holes.
Abstract:
An electronic device is disclosed and includes a substrate, a circuit layer, and a plurality of diodes. The substrate has a plurality of structures. The circuit layer is disposed on the substrate. The diodes are disposed on the circuit layer, wherein a first spacing is defined as a distance between a center point of a first one of the structures and a center point of a second one of the structures, a second spacing is defined as a distance between a center point of a third one of the structures and a center point of a fourth one of the structures, and an absolute value of a difference between the first spacing and the second spacing is less than 0.5 times radius of curvature of the electronic device when the electronic device is bent.
Abstract:
A backlight module includes a light guiding unit having a light input surface and a light-emitting unit having light-emitting elements disposed along a first direction and adjacent to the light input surface. A second direction is from the light input surface to the light-emitting unit. A first protruding portion of the light guiding unit includes a sharp protrusion tip at the bottom surface and a part of the light input surface. A curved convex connecting surface of the light input surface connects to the first protruding portion to form a turning portion which is disposed between the connecting surface and the first protruding portion, and is at its intermediate portion and outwardly protrudes toward the light-emitting elements along the second direction. The light-emitting elements are across from the connecting surface and generally positioned above the first protruding portion in the third direction.
Abstract:
An electronic device is disclosed and includes a base substrate, a first circuit layer and a plurality of light-emitting elements. The base substrate has a first surface and a second surface opposite to each other. The first circuit layer includes a first portion and a second portion. The first portion is disposed on the first surface of the base substrate, and the second portion is disposed on the second surface of the base substrate. The light-emitting elements are disposed on the first portion of the first circuit layer. At least one of the second surface of the base substrate and the first portion of the first circuit layer includes at least one microstructure.
Abstract:
An electronic device and a tiling electronic apparatus are disclosed and include a base substrate, a first circuit layer and a plurality of light-emitting elements. The base substrate has a first surface and a second surface opposite to each other. The first circuit layer includes a first portion and a second portion. The first portion is disposed on the first surface of the base substrate, and the second portion is disposed on the second surface of the base substrate. The light-emitting elements are disposed on the first portion of the first circuit layer. At least one of the second surface of the base substrate and the first portion of the first circuit layer includes at least one microstructure.