公开(公告)号：US10593709B2

公开(公告)日：2020-03-17

申请号：US16130450

申请日：2018-09-13

Applicant: InnoLux Corporation

Inventor： Hsin-Hung Lin ,  Chin-Chi Chen

IPC: H01L27/12 ,  H01L27/02 ,  H01L29/786 ,  H01L27/146 ,  H01L23/60 ,  G02F1/1362

Abstract: A panel device includes a substrate, a common electrode, and an electrostatic protection component. The substrate includes an active area and a peripheral area, the peripheral area is outside of the active area, and a plurality of signal lines is disposed on the substrate. The common electrode is disposed on the substrate, and at least part of the common electrode is disposed in the peripheral area. The electrostatic protection component is disposed in the peripheral area of the substrate and electrically connected to one of the plurality of signal lines and the common electrode, and the electrostatic protection component includes a first double-gate transistor. The first double-gate transistor includes a first gate, a second gate, a first electrode and a second electrode. The first gate is electrically connected to the first electrode, and the second gate is electrically connected to the second electrode.

公开(公告)号：US20240072075A1

公开(公告)日：2024-02-29

申请号：US18354617

申请日：2023-07-18

Applicant: InnoCare Optoelectronics Corporation ,  Innolux Corporation

Inventor： Chin-Chi Chen ,  Ting-Yu Chen ,  Yi-Ju Tseng ,  Ji-Zhen Lu

IPC: H01L27/144

CPC classification number: H01L27/1443

Abstract: An electronic device including a substrate, a first electrode layer, a photodiode, an insulating layer, a second electrode layer, and a first transparent conductive layer is provided. The first electrode layer is disposed on the substrate. The photodiode is disposed on the first electrode layer and is electrically connected to the first electrode layer. The insulating layer is disposed on the photodiode. The second electrode layer is disposed on the insulating layer and is electrically connected to the photodiode. The first transparent conductive layer is disposed on the insulating layer and contacts the second electrode layer. A manufacturing method of an electronic device is also provided.