公开(公告)号：US11637061B2

公开(公告)日：2023-04-25

申请号：US16993291

申请日：2020-08-14

Applicant: InnoLux Corporation

Inventor： Chiu-Yuan Huang ,  Pei-Chieh Chen ,  Yu-Ting Liu ,  Tsung-Yeh Ho

IPC: H01L23/498 ,  H05K1/18 ,  G02F1/1333 ,  H01R12/77 ,  H01L51/00 ,  H01R12/70

Abstract: The present disclosure provides an electronic device including a substrate, a conductive element, an extending element and an insulating layer. The substrate includes an edge, the conductive element is disposed on the substrate, the extending element is disposed corresponding to at least a portion of the conductive element and extends to the edge of the substrate, and the insulating layer separates the conductive element and the extending element.

公开(公告)号：US12009291B2

公开(公告)日：2024-06-11

申请号：US18122133

申请日：2023-03-16

Applicant: InnoLux Corporation

Inventor： Chiu-Yuan Huang ,  Pei-Chieh Chen ,  Yu-Ting Liu ,  Tsung-Yeh Ho

IPC: H01L23/498 ,  G02F1/1333 ,  H01R12/70 ,  H01R12/77 ,  H05K1/18 ,  H10K77/10

CPC classification number: H01L23/4985 ,  G02F1/133305 ,  H01R12/7076 ,  H01R12/77 ,  H05K1/189 ,  H10K77/111 ,  H05K2201/09009 ,  H05K2201/10128

Abstract: The present disclosure provides an electronic device including a substrate, an extending element, a conductive element and a first insulating layer. The substrate includes an edge. The extending element is disposed on the substrate and includes a first conductive layer and a semiconductor layer, the first conductive layer and the semiconductor layer are overlapped, and the semiconductor layer extends to the edge of the substrate. The conductive element is overlapped with the first conductive layer. The insulating layer is disposed between the conductive element and the extending element.

公开(公告)号：US20230230914A1

公开(公告)日：2023-07-20

申请号：US18122133

申请日：2023-03-16

Applicant: InnoLux Corporation

Inventor： Chiu-Yuan Huang ,  Pei-Chieh Chen ,  Yu-Ting Liu ,  Tsung-Yeh Ho

IPC: H01L23/498 ,  H05K1/18 ,  G02F1/1333 ,  H01R12/77 ,  H01R12/70 ,  H10K77/10

CPC classification number: H01L23/4985 ,  H05K1/189 ,  G02F1/133305 ,  H01R12/77 ,  H01R12/7076 ,  H10K77/111 ,  H05K2201/09009 ,  H05K2201/10128

Abstract: The present disclosure provides an electronic device including a substrate, an extending element, a conductive element and a first insulating layer. The substrate includes an edge. The extending element is disposed on the substrate and includes a first conductive layer and a semiconductor layer, the first conductive layer and the semiconductor layer are overlapped, and the semiconductor layer extends to the edge of the substrate. The conductive element is overlapped with the first conductive layer. The insulating layer is disposed between the conductive element and the extending element.

公开(公告)号：US20240290711A1

公开(公告)日：2024-08-29

申请号：US18656622

申请日：2024-05-07

Applicant: InnoLux Corporation

Inventor： Chiu-Yuan Huang ,  Pei-Chieh Chen ,  Yu-Ting Liu ,  Tsung-Yeh Ho

IPC: H01L23/498 ,  G02F1/1333 ,  H01R12/70 ,  H01R12/77 ,  H05K1/18 ,  H10K77/10

CPC classification number: H01L23/4985 ,  G02F1/133305 ,  H01R12/7076 ,  H01R12/77 ,  H05K1/189 ,  H10K77/111 ,  H05K2201/09009 ,  H05K2201/10128

Abstract: The present disclosure provides an electronic device including a conductive element, a first insulating layer, an extending element, and a second insulating layer disposed on a substrate. At least a portion of the first insulating layer is located between the conductive element and the extending element. The second insulating layer is disposed on the conductive element and the extending element. In a cross-sectional view, a thickness of the first insulating layer is different from a thickness of the second insulating layer. In a top view, the extending element has a first portion extending to an edge of the substrate, the extending element has a second portion connecting the first portion and disposed between the first portion and the conductive element, and the first minimum width of the first portion is less than the second minimum width of the second portion.

公开(公告)号：US20210074610A1

公开(公告)日：2021-03-11

申请号：US16993291

申请日：2020-08-14

Applicant: InnoLux Corporation

Inventor： Chiu-Yuan Huang ,  Pei-Chieh Chen ,  Yu-Ting Liu ,  Tsung-Yeh Ho

IPC: H01L23/498 ,  H05K1/18 ,  G02F1/1333 ,  H01R12/70 ,  H01R12/77 ,  H01L51/00

Abstract: The present disclosure provides an electronic device including a substrate, a conductive element, an extending element and an insulating layer. The substrate includes an edge, the conductive element is disposed on the substrate, the extending element is disposed corresponding to at least a portion of the conductive element and extends to the edge of the substrate, and the insulating layer separates the conductive element and the extending element.