Electronic device having a curved surface and method for fabricating the same

    公开(公告)号:US11307443B2

    公开(公告)日:2022-04-19

    申请号:US17224397

    申请日:2021-04-07

    Abstract: An electronic device having a curved surface is provided. The electronic device having the curved surface includes a back frame having a curved surface, a panel having a curved surface disposed on the back frame having the curved surface, a protective substrate having a curved surface disposed on the panel having the curved surface, and a patterned adhesive element disposed on a portion of the back frame having the curved surface. The back frame having the curved surface and the protective substrate having the curved surface adhere to each other via the patterned adhesive element. The method for fabricating the electronic device having the curved surface is also provided.

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