公开(公告)号：US20240145461A1

公开(公告)日：2024-05-02

申请号：US18480511

申请日：2023-10-04

Applicant: Innolux Corporation

Inventor： Ker-Yih Kao ,  Tong-Jung Wang ,  Wen-Chieh Lin ,  Ming-Chun Tseng ,  Yi-Hung Lin

IPC: H01L27/02

CPC classification number: H01L27/0248

Abstract: A modulation device includes a substrate, an electrostatic discharge protection element, an electronic element, and a driving element. The substrate has an active region. The electrostatic discharge protection element is arranged around the active region. The electronic element is disposed in the active region. The driving element is electrically connected to the electronic element.

公开(公告)号：US20210259109A1

公开(公告)日：2021-08-19

申请号：US17168189

申请日：2021-02-05

Applicant: Innolux Corporation

Inventor： Chialung Wu ,  Wen-Chieh Lin ,  Chia Chun Yang

IPC: H05K1/11 ,  H05K1/02

Abstract: The disclosure provides an electronic device, including a base, a flexible substrate, and a plurality of wires. The base has an active area and a peripheral area. The flexible substrate is disposed on the peripheral area and the base. The plurality of wires are disposed on the base and the flexible substrate. The plurality of wires extend from the active area to the peripheral area, and the peripheral area partially overlaps the frame portion. The plurality of wires extend along the frame portion to the extension portion. And the flexible substrate is provided between the plurality of wires and the base. The electronic device in the disclosure is conducive to providing smaller wire pitch, reducing the difficulty in connecting the electronic device and the leads of an external circuit board.

公开(公告)号：US11516926B2

公开(公告)日：2022-11-29

申请号：US16676893

申请日：2019-11-07

Applicant: InnoLux Corporation

Inventor： Pai-Chi Tsai ,  Wen-Chieh Lin

IPC: H05K3/46 ,  H05K3/04 ,  H05K1/02

Abstract: A method for manufacturing a flexible circuit board is provided. The method for manufacturing a flexible circuit board includes the following steps: providing a carrier substrate, forming a flexible substrate on the carrier substrate, and forming a plurality of circuit strings on the flexible substrate. A flexible circuit board manufactured by the above method is also provided.

公开(公告)号：US11425818B2

公开(公告)日：2022-08-23

申请号：US17168189

申请日：2021-02-05

Applicant: Innolux Corporation

Inventor： Chialung Wu ,  Wen-Chieh Lin ,  Chia Chun Yang

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H01L27/32

Abstract: The disclosure provides an electronic device, including a base, a flexible substrate, and a plurality of wires. The base has an active area and a peripheral area. The flexible substrate is disposed on the peripheral area and the base. The plurality of wires are disposed on the base and the flexible substrate. The plurality of wires extend from the active area to the peripheral area, and the peripheral area partially overlaps the frame portion. The plurality of wires extend along the frame portion to the extension portion. And the flexible substrate is provided between the plurality of wires and the base. The electronic device in the disclosure is conducive to providing smaller wire pitch, reducing the difficulty in connecting the electronic device and the leads of an external circuit board.

公开(公告)号：US10553150B2

公开(公告)日：2020-02-04

申请号：US16132898

申请日：2018-09-17

Applicant: InnoLux Corporation

Inventor： Chia-Chieh Fan ,  Wen-Chieh Lin ,  Tong-Jung Wang

IPC: G09G3/32 ,  H01L27/15 ,  G09F9/33 ,  H05K3/32

Abstract: A display device is provided and includes: a display panel; and a circuit board electrically connected to the display panel and including: a substrate; a first conductive layer disposed on the substrate and including a first connecting pad and a second connecting pad; a second conductive layer disposed on and electrically connected to the second connecting pad; a first electronic component disposed on and electrically connected to the first connecting pad; and a second electronic component disposed on the second conductive layer and electrically connected to the second connecting pad through the second conductive layer. The first connecting pad has a first thickness. A total thickness of the second connecting pad and the second conductive layer is a second thickness. The second thickness is greater than the first thickness. A ratio of the second thickness to the first thickness ranges from 1.2 to 5000.