公开(公告)号：US20230027220A1

公开(公告)日：2023-01-26

申请号：US17960816

申请日：2022-10-05

Applicant: InnoLux Corporation

Inventor： Hsueh-Hsuan Chou ,  Chia-Chieh Fan ,  Kuan-Jen Wang ,  Cheng-Chi Wang ,  Yi-Hung Lin ,  Li-Wei Sung

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56

Abstract: The present disclosure provides a package device and a manufacturing method thereof. The package device includes an electronic device, a conductive pad having a first bottom surface, and a redistribution layer disposed between the conductive pad and the electronic device. The redistribution layer has a second bottom surface, and the conductive pad is electrically connected to the electronic device through the redistribution layer. The first bottom surface is closer to the electronic device than the second bottom in a normal direction of the electronic device.

公开(公告)号：US11488899B2

公开(公告)日：2022-11-01

申请号：US16941516

申请日：2020-07-28

Applicant: InnoLux Corporation

Inventor： Hsueh-Hsuan Chou ,  Chia-Chieh Fan ,  Kuan-Jen Wang ,  Cheng-Chi Wang ,  Yi-Hung Lin ,  Li-Wei Sung

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065

Abstract: The present disclosure provides a package device including a conductive pad, a protecting block, and a redistribution layer. The protecting block is disposed on the conductive pad. The redistribution layer is disposed on the protecting block, and the conductive pad is electrically connected to the redistribution layer through the protecting block.

公开(公告)号：US10236469B2

公开(公告)日：2019-03-19

申请号：US15621212

申请日：2017-06-13

Applicant: InnoLux Corporation

Inventor： Chia-Yuan Chang ,  Chia-Chieh Fan

IPC: H01L33/00 ,  H01L51/52 ,  G01S7/06 ,  G02F1/1345 ,  H03K19/177 ,  H01L27/32

Abstract: A display device includes a display panel, a driving circuit board, and an electronic connector. The electronic connector connects the display panel and the driving circuit board. The driving circuit board is configured with a first wire, a second wire, a third wire, a fourth wire and a fifth wire arranged in order. The first wire, the second wire, the third wire and the fifth wire extend to the electronic connector and connect to the display panel. A first convergence point of the second wire and the third wire is located on the electronic connector, and a second convergence point of the fourth wire and the third wire is located on the driving circuit board. A detection method of the display device is also disclosed.

公开(公告)号：US12230558B2

公开(公告)日：2025-02-18

申请号：US17960816

申请日：2022-10-05

Applicant: InnoLux Corporation

Inventor： Hsueh-Hsuan Chou ,  Chia-Chieh Fan ,  Kuan-Jen Wang ,  Cheng-Chi Wang ,  Yi-Hung Lin ,  Li-Wei Sung

IPC: H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065

Abstract: The present disclosure provides a package device and a manufacturing method thereof. The package device includes an electronic device, a conductive pad having a first bottom surface, and a redistribution layer disposed between the conductive pad and the electronic device. The redistribution layer has a second bottom surface, and the conductive pad is electrically connected to the electronic device through the redistribution layer. The first bottom surface is closer to the electronic device than the second bottom in a normal direction of the electronic device.

公开(公告)号：US20230025999A1

公开(公告)日：2023-01-26

申请号：US17849701

申请日：2022-06-27

Applicant: Innolux Corporation

Inventor： Hao-Jung Huang ,  Chi-Liang Chang ,  I-Ho Shen ,  Ker-Yih Kao ,  Yun-Sheng Chen ,  Chiao-Chu Tsui ,  Chih-Han Ma ,  Shan-Shan Hsu ,  Chia-Chieh Fan

IPC: H01L23/31 ,  H01L23/60 ,  H01L27/15 ,  H01L25/075 ,  H01L51/52 ,  H01L25/04 ,  H01L27/32

Abstract: An electronic device including an electronic unit and a functional unit is provided. The electronic unit includes a substrate, a plurality of semiconductor components, and a cover layer. The substrate has a plurality of first side surfaces. The semiconductor components are disposed on the substrate. The cover layer is disposed on the semiconductor components and has a plurality of second side surfaces. The functional unit is disposed on at least one of at least one of the first side surfaces and at least one of the second side surfaces.

公开(公告)号：US20220344281A1

公开(公告)日：2022-10-27

申请号：US17701693

申请日：2022-03-23

Applicant: Innolux Corporation

Inventor： Ming-Tsang Wu ,  Jia-Sin Li ,  Chia-Chieh Fan

IPC: H01L23/00 ,  H01L27/12

Abstract: An electronic device including a flexible substrate, a plurality of light emitting units, and a plurality of supporting elements is provided. The flexible substrate has a first surface and a second surface opposite to each other. The light emitting units are disposed on the first surface. The supporting elements are disposed on the second surface. The supporting element includes an arc-shaped structure.

公开(公告)号：US10553150B2

公开(公告)日：2020-02-04

申请号：US16132898

申请日：2018-09-17

Applicant: InnoLux Corporation

Inventor： Chia-Chieh Fan ,  Wen-Chieh Lin ,  Tong-Jung Wang

IPC: G09G3/32 ,  H01L27/15 ,  G09F9/33 ,  H05K3/32

Abstract: A display device is provided and includes: a display panel; and a circuit board electrically connected to the display panel and including: a substrate; a first conductive layer disposed on the substrate and including a first connecting pad and a second connecting pad; a second conductive layer disposed on and electrically connected to the second connecting pad; a first electronic component disposed on and electrically connected to the first connecting pad; and a second electronic component disposed on the second conductive layer and electrically connected to the second connecting pad through the second conductive layer. The first connecting pad has a first thickness. A total thickness of the second connecting pad and the second conductive layer is a second thickness. The second thickness is greater than the first thickness. A ratio of the second thickness to the first thickness ranges from 1.2 to 5000.

公开(公告)号：US20250157904A1

公开(公告)日：2025-05-15

申请号：US19019362

申请日：2025-01-13

Applicant: InnoLux Corporation

Inventor： Hsueh-Hsuan Chou ,  Chia-Chieh Fan ,  Kuan-Jen Wang ,  Cheng-Chi Wang ,  Yi-Hung Lin ,  Li-Wei Sung

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00 ,  H01L25/065

Abstract: A manufacturing method of a package device is provided. First, a carrier is provided, and then a conductive element is formed on the carrier. Thereafter, a conductive pad is formed on the conductive element. Next, a redistribution layer is formed on the conductive pad. Then, the carrier and at least a part of the conductive element are removed.

公开(公告)号：US11782308B2

公开(公告)日：2023-10-10

申请号：US17697080

申请日：2022-03-17

Applicant: InnoLux Corporation

Inventor： Shan-Shan Hsu ,  Ming-Tsang Wu ,  Chia-Chieh Fan

IPC: G02F1/13357 ,  H05K1/18 ,  G02F1/1335

CPC classification number: G02F1/133603 ,  G02F1/133528 ,  H05K1/189 ,  G02F2202/28 ,  H05K2201/10136

Abstract: An electronic device is provided. The electronic device includes a backlight module, a display panel, an adhesive layer, and a flexible circuit board. The display panel is disposed on the backlight module. The adhesive layer is disposed between the backlight module and the display panel. The adhesive layer includes an opening. The flexible circuit board is electrically connected to the display panel. The flexible circuit board overlaps the opening.

公开(公告)号：US20230083007A1

公开(公告)日：2023-03-16

申请号：US17988775

申请日：2022-11-17

Applicant: Innolux Corporation

Inventor： Jia Sin Li ,  Tong-Jung Wang ,  Chia-Chieh Fan ,  Shan Shan Hsu ,  Chih Han Ma

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/46

Abstract: An electronic device and a method for manufacturing a flexible circuit board are provided. The electronic device includes the flexible circuit board. The flexible circuit board includes a first flexible substrate, a first seed layer, a first conductive layer, and a second seed layer. The first seed layer is disposed on the first flexible substrate. The first conductive layer is disposed on the first seed layer. The second seed layer is disposed on the first conductive layer. The first seed layer is in contact with the first conductive layer.