公开(公告)号：US20240136308A1

公开(公告)日：2024-04-25

申请号：US18401703

申请日：2024-01-01

Applicant: Innolux Corporation

Inventor： Yeong-E Chen ,  Wei-Hsuan Chen ,  Chun-Yuan Huang

IPC: H01L23/64 ,  H01L23/498

CPC classification number: H01L23/642 ,  H01L23/49822 ,  H01L23/49838 ,  H01L28/60

Abstract: An embodiment of the disclosure provides an electronic assembly including a stacked structure, a first integrated circuit, a first passive component, and a first electrode. The stacked structure comprises a plurality of insulating layers and a plurality of conductive layers. The first passive component is disposed between the stacked structure and the first integrated circuit. The first electrode is disposed between the stacked structure and the first passive component. The first passive component is electrically connected to the stacked structure through the first electrode.

公开(公告)号：US11901315B2

公开(公告)日：2024-02-13

申请号：US17495821

申请日：2021-10-07

Applicant: Innolux Corporation

Inventor： Yeong-E Chen ,  Wei-Hsuan Chen ,  Chun-Yuan Huang

IPC: H01L23/64 ,  H01L23/522 ,  H01L23/498 ,  H01L49/02

CPC classification number: H01L23/642 ,  H01L23/49822 ,  H01L23/49838 ,  H01L28/60

Abstract: An embodiment of the disclosure provides a package device including a redistribution layer, an integrated passive device layer, a first port, and a second port. The integrated passive device layer contacts the redistribution layer. The integrated passive device layer has at least one capacitor. The at least one capacitor includes a first capacitor and a second capacitor. The first port is electrically connected to the first capacitor and the second capacitor. The second port is provided opposite to the first port. The second port is electrically connected to the first capacitor and the second capacitor. The first port and the second port have the same resistance.

公开(公告)号：US20220285294A1

公开(公告)日：2022-09-08

申请号：US17495821

申请日：2021-10-07

Applicant: Innolux Corporation

Inventor： Yeong-E Chen ,  Wei-Hsuan Chen ,  Chun-Yuan Huang

IPC: H01L23/64 ,  H01L23/498 ,  H01L49/02

Abstract: An embodiment of the disclosure provides a package device including a redistribution layer, an integrated passive device layer, a first port, and a second port. The integrated passive device layer contacts the redistribution layer. The integrated passive device layer has at least one capacitor. The at least one capacitor includes a first capacitor and a second capacitor. The first port is electrically connected to the first capacitor and the second capacitor. The second port is provided opposite to the first port. The second port is electrically connected to the first capacitor and the second capacitor. The first port and the second port have the same resistance.