公开(公告)号：US20240312983A1

公开(公告)日：2024-09-19

申请号：US18671908

申请日：2024-05-22

申请人： Innolux Corporation

发明人： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC分类号： H01L27/06 ,  H01L21/8234 ,  H01L23/522 ,  H01L23/538 ,  H01L29/93

CPC分类号： H01L27/0629 ,  H01L21/823475 ,  H01L23/5223 ,  H01L29/93 ,  H01L23/5385 ,  H01L27/0694

摘要： The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, a PN junction assembly, and a transistor circuit. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer is formed above the second surface. The second metal layer is formed on the second surface. The PN junction assembly is disposed on the first surface and electrically connected with the first metal layer and the second metal layer. The PN junction assembly includes a variable capacitor. The transistor circuit is electrically connecting with the second metal layer.

公开(公告)号：US12034002B2

公开(公告)日：2024-07-09

申请号：US17678040

申请日：2022-02-23

申请人： Innolux Corporation

发明人： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC分类号： H01L27/06 ,  H01L21/8234 ,  H01L23/522 ,  H01L29/93 ,  H01L23/538

CPC分类号： H01L27/0629 ,  H01L21/823475 ,  H01L23/5223 ,  H01L29/93 ,  H01L23/5385 ,  H01L27/0694

摘要： The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, and an electronic assembly. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer has an opening and is formed on the first surface. The second metal layer is formed on the second surface and a projection of the opening on the second surface is overlapped with a projection of the second metal layer on the second surface. The electronic assembly is electrically connected with the first metal layer and the second metal layer.

公开(公告)号：US11342657B2

公开(公告)日：2022-05-24

申请号：US16932862

申请日：2020-07-20

申请人： Innolux Corporation

发明人： Yi Hung Lin ,  Chung-Kuang Wei ,  Tang Chin Hung ,  I-Yin Li ,  Chia-Chi Ho

IPC分类号： H01Q1/38 ,  H01Q1/40

摘要： An antenna device is provided, including a first substrate, a first conductive element, a second substrate, a second conductive element, and an insulating layer. The first conductive element is disposed on the first substrate to define, on the first substrate, a recessed region adjacent to the first conductive element. The second substrate faces the first substrate. The second conductive element is disposed on the second substrate and located between the first substrate and the second substrate. The insulating layer is disposed between the first substrate and the second substrate. In a top view of the antenna device, the second conductive element overlaps the first conductive element and the recessed region, and the insulating layer at least partially overlaps the recessed region.

公开(公告)号：US11817388B2

公开(公告)日：2023-11-14

申请号：US17851046

申请日：2022-06-28

申请人： Innolux Corporation

发明人： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC分类号： H01L23/528 ,  H01L27/06 ,  H01L23/522 ,  H01L21/8234 ,  H01L29/93 ,  H01L23/538 ,  H01L21/60

CPC分类号： H01L23/5283 ,  H01L21/823475 ,  H01L23/5223 ,  H01L23/5226 ,  H01L27/0629 ,  H01L29/93 ,  H01L23/5385 ,  H01L27/0694 ,  H01L2021/6006

摘要： The disclosure provides an electronic apparatus. The electronic apparatus includes a substrate, a first metal layer, an insulating layer, a first conductor, an electronic assembly and a transistor circuit die. The first metal layer is disposed on the substrate. The insulating layer is disposed on the substrate. The first conductor is formed in a first via of the insulating layer. The electronic assembly is disposed on the substrate and electrically connected to the first metal layer through the first conductor. The transistor circuit die is electrically connected to the first metal layer.

公开(公告)号：US20220328406A1

公开(公告)日：2022-10-13

申请号：US17851047

申请日：2022-06-28

申请人： Innolux Corporation

发明人： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC分类号： H01L23/528 ,  H01L27/06 ,  H01L23/522 ,  H01L21/8234 ,  H01L29/93

摘要： The disclosure provides an electromagnetic wave adjustment apparatus includes a control circuit, a transistor circuit die and an electronic assembly. The transistor circuit die receives a control signal from the control circuit and drives the electronic assembly.

公开(公告)号：US20210035909A1

公开(公告)日：2021-02-04

申请号：US16920448

申请日：2020-07-03

申请人： Innolux Corporation

发明人： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC分类号： H01L23/528 ,  H01L27/06 ,  H01L23/522 ,  H01L21/8234

摘要： The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, and an electronic assembly. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer has an opening and is formed on the first surface. The second metal layer is formed on the second surface and a projection of the opening on the second surface is overlapped with a projection of the second metal layer on the second surface. The electronic assembly is electrically connected with the first metal layer and the second metal layer.

公开(公告)号：US12015027B2

公开(公告)日：2024-06-18

申请号：US17851047

申请日：2022-06-28

申请人： Innolux Corporation

发明人： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC分类号： H01L27/06 ,  H01L21/8234 ,  H01L23/522 ,  H01L29/93 ,  H01L23/538

CPC分类号： H01L27/0629 ,  H01L21/823475 ,  H01L23/5223 ,  H01L29/93 ,  H01L23/5385 ,  H01L27/0694

摘要： The disclosure provides an electromagnetic wave adjustment apparatus includes a control circuit, a transistor circuit die and an electronic assembly. The transistor circuit die receives a control signal from the control circuit and drives the electronic assembly.

公开(公告)号：US20220181257A1

公开(公告)日：2022-06-09

申请号：US17678040

申请日：2022-02-23

申请人： Innolux Corporation

发明人： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC分类号： H01L23/528 ,  H01L27/06 ,  H01L23/522 ,  H01L21/8234 ,  H01L29/93

摘要： The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, and an electronic assembly. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer has an opening and is formed on the first surface. The second metal layer is formed on the second surface and a projection of the opening on the second surface is overlapped with a projection of the second metal layer on the second surface. The electronic assembly is electrically connected with the first metal layer and the second metal layer.

公开(公告)号：US20210050657A1

公开(公告)日：2021-02-18

申请号：US16932862

申请日：2020-07-20

申请人： Innolux Corporation

发明人： Yi Hung Lin ,  Chung-Kuang Wei ,  Tang Chin Hung ,  I-Yin Li ,  Chia-Chi Ho

IPC分类号： H01Q1/38 ,  H01Q1/40

摘要： An antenna device is provided, including a first substrate, a first conductive element, a second substrate, a second conductive element, and an insulating layer. The first conductive element is disposed on the first substrate to define, on the first substrate, a recessed region adjacent to the first conductive element. The second substrate faces the first substrate. The second conductive element is disposed on the second substrate and located between the first substrate and the second substrate. The insulating layer is disposed between the first substrate and the second substrate. In a top view of the antenna device, the second conductive element overlaps the first conductive element and the recessed region, and the insulating layer at least partially overlaps the recessed region.

公开(公告)号：US20240297168A1

公开(公告)日：2024-09-05

申请号：US18663100

申请日：2024-05-14

申请人： Innolux Corporation

发明人： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC分类号： H01L27/06 ,  H01L21/8234 ,  H01L23/522 ,  H01L23/538 ,  H01L29/93

CPC分类号： H01L27/0629 ,  H01L21/823475 ,  H01L23/5223 ,  H01L29/93 ,  H01L23/5385 ,  H01L27/0694

摘要： The disclosure provides an electronic apparatus. The electronic apparatus includes an insulator, a driving unit, an electronic unit, and a circuit unit. The driving unit is overlapped with the insulator. The electronic unit is overlapped with the insulator. The circuit unit is electrically connected to the driving unit. The driving unit receives a signal from the circuit unit and drives the electronic unit.