公开(公告)号：US20200066626A1

公开(公告)日：2020-02-27

申请号：US16107655

申请日：2018-08-21

Applicant: Intel Corporation

Inventor： Jason M. Gamba ,  David Unruh ,  Adrian Kemal Bayraktaroglu ,  Thomas S. Heaton

IPC: H01L23/498 ,  H01L21/683 ,  H01L21/48

Abstract: Disclosed herein are pocket structures, materials, and methods for integrated circuit (IC) package supports. For example, in some embodiments, an IC package support may include: an interconnect pocket having sidewalls provided by a dielectric material; and a conductive contact at a bottom of the interconnect pocket, wherein the conductive contact includes a first metal material and a second metal material, the first metal material provides a bottom surface of the interconnect pocket and is in contact with the dielectric material, the second metal material has a different composition than the first metal material, and the second metal material is in contact with the dielectric material.