公开(公告)号：US20240175640A1

公开(公告)日：2024-05-30

申请号：US18395919

申请日：2023-12-26

Applicant: Intel Corporation

Inventor： Santosh Gangal ,  Akarsha Kadadevaramath ,  Raghavendra S. Kanivihalli ,  Prakash Kurma Raju ,  Navneet Singh ,  Sarma Vmk Vedhanabhatla

IPC: F28D15/04

CPC classification number: F28D15/04

Abstract: A heat pipe, including: a variable dimension heat pipe exoskeleton formed of a heat-conductive material by blow molding or additive manufacturing, wherein the variable dimension heat pipe exoskeleton including: a first heat pipe exoskeleton portion with a dimension having a first value; and a second heat pipe exoskeleton portion with the dimension having a second value different from the first value. Further, a method of manufacturing a heat pipe, including: providing a heat-conductive material; and performing blow molding or additive manufacturing to form a variable dimension heat pipe exoskeleton of the heat-conductive material, wherein the heat pipe exoskeleton has a first heat pipe exoskeleton portion with a dimension having a first value, and a second heat pipe exoskeleton portion with the dimension having a second value different from the first value.

公开(公告)号：US11139553B2

公开(公告)日：2021-10-05

申请号：US16233791

申请日：2018-12-27

Applicant: Intel Corporation

Inventor： Jayprakash Thakur ,  Prakash Kurma Raju ,  Prasanna Pichumani ,  Akarsha Kadadevaramath

IPC: H01Q1/24 ,  H01Q1/38 ,  H05K5/04 ,  C25D11/00 ,  C25D11/12 ,  C25D11/18

Abstract: Technologies for a metal chassis for an electronic device are disclosed. A manufacturer may manufacture a chassis of an electronic device by machining a recess into a chassis preform and perform an anodization of the chassis. The manufacturer may machine the side of the chassis preform opposite the recess to a predefined thickness, and then perform a subsequent anodization. The predefined thickness is selected so that, after the subsequent anodization, there is a single anodized layer between the surface of the recess and the chassis surface on the opposite side. The single anodized layer is non-conductive, allowing electromagnetic signals of an antenna to pass through.

公开(公告)号：US20190131692A1

公开(公告)日：2019-05-02

申请号：US16233791

申请日：2018-12-27

Applicant: Intel Corporation

Inventor： Jayprakash Thakur ,  Prakash Kurma Raju ,  Prasanna Pichumani ,  Akarsha Kadadevaramath

IPC: H01Q1/24 ,  H05K5/04 ,  H01Q1/38

Abstract: Technologies for a metal chassis for an electronic device are disclosed. A manufacturer may manufacture a chassis of an electronic device by machining a recess into a chassis preform and perform an anodization of the chassis. The manufacturer may machine the side of the chassis preform opposite the recess to a predefined thickness, and then perform a subsequent anodization. The predefined thickness is selected so that, after the subsequent anodization, there is a single anodized layer between the surface of the recess and the chassis surface on the opposite side. The single anodized layer is non-conductive, allowing electromagnetic signals of an antenna to pass through.