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公开(公告)号:US12191568B2
公开(公告)日:2025-01-07
申请号:US17732895
申请日:2022-04-29
Applicant: Intel Corporation
Inventor: Jayprakash Thakur , Prakash Kurma Raju , Gustavo Fricke
IPC: H01Q13/10 , H01Q1/22 , H01Q1/44 , H01Q5/00 , H01Q21/06 , G06F1/16 , H01Q1/24 , H01Q5/15 , H01Q13/16
Abstract: Example slot antennas for electronic user device and related methods are disclosed herein. An example electronic user device includes a first housing; a second housing rotatably coupled to the first housing; a display screen carried by the second housing; a dual-band antenna carried by the second housing; and a bezel about the display screen, the bezel to cover the dual-band antenna.
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公开(公告)号:US20230198568A1
公开(公告)日:2023-06-22
申请号:US17559843
申请日:2021-12-22
Applicant: Intel Corporation
Inventor: Maruti Tamrakar , Jayprakash Thakur , Sagar Gupta , Rajasekar Arumanayagam , Amarjeet Kumar
IPC: H04B1/44
CPC classification number: H04B1/44
Abstract: Embodiments of the present disclosure are directed to antenna switching systems. For example, some embodiments may include a switching system to allow a computing system to switch between an internal antenna and an external antenna. Other embodiments may be described and claimed.
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公开(公告)号:US20200091608A1
公开(公告)日:2020-03-19
申请号:US16472830
申请日:2017-12-20
Applicant: Intel Corporation
Inventor: Erkan Alpman , Arnaud Lucres Amadjikpe , Omer Asaf , Kameran Azadet , Rotem Banin , Miroslav Baryakh , Anat Bazov , Stefano Brenna , Bryan K. Casper , Anandaroop Chakrabarti , Gregory Chance , Debabani Choudhury , Emanuel Cohen , Claudio Da Silva , Sidharth Dalmia , Saeid Daneshgar Asl , Kaushik Dasgupta , Kunal Datta , Brandon Davis , Ofir Degani , Amr M. Fahim , Amit Freiman , Michael Genossar , Eran Gerson , Eyal Goldberger , Eshel Gordon , Meir Gordon , Josef Hagn , Shinwon Kang , Te Yu Kao , Noam Kogan , Mikko S. Komulainen , Igal Yehuda Kushnir , Saku Lahti , Mikko M. Lampinen , Naftali Landsberg , Wook Bong Lee , Run Levinger , Albert Molina , Resti Montoya Moreno , Tawfiq Musah , Nathan G. Narevsky , Hosein Nikopour , Oner Orhan , Georgios Palaskas , Stefano Pellerano , Ron Pongratz , Ashoke Ravi , Shmuel Ravid , Peter Andrew Sagazio , Eren Sasoglu , Lior Shakedd , Gadi Shor , Baljit Singh , Menashe Soffer , Ra'anan Sover , Shilpa Talwar , Nebil Tanzi , Moshe Teplitsky , Chintan S. Thakkar , Jayprakash Thakur , Avi Tsarfati , Yossi Tsfati , Marian Verhelst , Nir Weisman , Shuhei Yamada , Ana M. Yepes , Duncan Kitchin
IPC: H01Q9/04 , H01Q1/38 , H01Q1/48 , H01Q1/24 , H01Q5/47 , H01Q3/24 , H01Q21/24 , H04B1/3827 , H04B15/04 , H04B7/0456 , H04B7/06 , H03L7/14
Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
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公开(公告)号:US11955732B2
公开(公告)日:2024-04-09
申请号:US18089220
申请日:2022-12-27
Applicant: Intel Corporation
Inventor: Erkan Alpman , Arnaud Lucres Amadjikpe , Omer Asaf , Kameran Azadet , Rotem Banin , Miroslav Baryakh , Anat Bazov , Stefano Brenna , Bryan K. Casper , Anandaroop Chakrabarti , Gregory Chance , Debabani Choudhury , Emanuel Cohen , Claudio Da Silva , Sidharth Dalmia , Saeid Daneshgar Asl , Kaushik Dasgupta , Kunal Datta , Brandon Davis , Ofir Degani , Amr M. Fahim , Amit Freiman , Michael Genossar , Eran Gerson , Eyal Goldberger , Eshel Gordon , Meir Gordon , Josef Hagn , Shinwon Kang , Te Yu Kao , Noam Kogan , Mikko S. Komulainen , Igal Yehuda Kushnir , Saku Lahti , Mikko M. Lampinen , Naftali Landsberg , Wook Bong Lee , Run Levinger , Albert Molina , Resti Montoya Moreno , Tawfiq Musah , Nathan G. Narevsky , Hosein Nikopour , Oner Orhan , Georgios Palaskas , Stefano Pellerano , Ron Pongratz , Ashoke Ravi , Shmuel Ravid , Peter Andrew Sagazio , Eren Sasoglu , Lior Shakedd , Gadi Shor , Baljit Singh , Menashe Soffer , Ra'anan Sover , Shilpa Talwar , Nebil Tanzi , Moshe Teplitsky , Chintan S. Thakkar , Jayprakash Thakur , Avi Tsarfati , Yossi Tsfati , Marian Verhelst , Nir Weisman , Shuhei Yamada , Ana M. Yepes , Duncan Kitchin
IPC: H01Q9/04 , H01Q1/24 , H01Q1/38 , H01Q1/48 , H01Q3/24 , H01Q5/47 , H01Q21/24 , H03L7/14 , H04B1/3827 , H04B7/0456 , H04B7/06 , H04B15/04
CPC classification number: H01Q9/0414 , H01Q1/243 , H01Q1/38 , H01Q1/48 , H01Q3/24 , H01Q5/47 , H01Q21/24 , H03L7/145 , H04B1/3827 , H04B7/0482 , H04B7/0639 , H04B15/04
Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
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公开(公告)号:US11804657B2
公开(公告)日:2023-10-31
申请号:US17448746
申请日:2021-09-24
Applicant: Intel Corporation
Inventor: Jayprakash Thakur , Maruti Tamrakar , Sagar Gupta , Harry G. Skinner , Prakash Kurma Raju
CPC classification number: H01Q13/10 , H05K1/0237 , H05K1/0277
Abstract: A chassis for an electronic device is provided. The chassis comprises a chassis part made of conducting material. At least one slot antenna is formed in the chassis part made of conducting material.
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公开(公告)号:US11450936B2
公开(公告)日:2022-09-20
申请号:US16948578
申请日:2020-09-24
Applicant: Intel Corporation
Inventor: Ramaswamy Parthasarathy , Punit Ashok Rathod , Jayprakash Thakur , Arvind Sundaram , Ajay Sharma , Nikita Bipin Ambasana , Satish Ramachandra , Vishram Shriram Pandit
Abstract: A communication system communicates data elements on a conducting wire. In an embodiment, a sequence of data elements to be transmitted is electrically represented on a pair of terminals, and a transmission element located at a first portion of the conducting wire transmits the sequence in the form of a wave on a surface of the conducting wire. The transmission element includes a first conductor wrapped around the first portion of the conducting wire, a first insulator located between the first conductor and the first portion of the conducting wire, and a conductive structure disposed around the first conductor. The conductive structure has a narrow cross section at one end and extends outwardly to a broader cross section at the other end. A first terminal of the pair of terminals is electrically connected to the first conductor and the second terminal is electrically connected to the conductive structure.
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公开(公告)号:US11322849B2
公开(公告)日:2022-05-03
申请号:US16716919
申请日:2019-12-17
Applicant: Intel Corporation
Inventor: Jayprakash Thakur , Prakash Kurma Raju , Gustavo Fricke
IPC: H01Q1/00 , H01Q13/10 , H01Q1/44 , H01Q5/00 , H01Q1/22 , H01Q21/06 , G06F1/16 , H01Q13/16 , H01Q1/24 , H01Q5/15
Abstract: Example slot antennas for electronic user device and related methods are disclosed herein. An example electronic user device including at least one of a lid or a base. The at least one of the lid or the base have a first surface and a second surface spaced apart from the second surface. The example electronic user device includes an antenna including a first aperture in the first surface and a second aperture in the second surface. The example user device includes a first cover at least partially disposed in the first aperture and a second cover at least partially disposed in the second aperture.
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公开(公告)号:US10389021B1
公开(公告)日:2019-08-20
申请号:US15897682
申请日:2018-02-15
Applicant: Intel Corporation
Inventor: Jayprakash Thakur
Abstract: An antenna isolation circuit configured to provide an isolation between two adjacent antennas in a wireless communication device is disclosed. The antenna isolation circuit comprises a partition line circuit comprising a conductive element configured to be placed between the two adjacent antennas; and a matching circuit having a first end and a second end. In some embodiments, the matching circuit is coupled to the partition line circuit at the first end and to a ground circuit at the second end. In some embodiments, the matching circuit is configured to provide an impedance. In some embodiments, a dimension of the conductive element and the impedance of the matching circuit are configured to result in an isolation between the two adjacent antennas.
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公开(公告)号:US12237589B2
公开(公告)日:2025-02-25
申请号:US17734529
申请日:2022-05-02
Applicant: Intel Corporation
Inventor: Erkan Alpman , Arnaud Lucres Amadjikpe , Omer Asaf , Kameran Azadet , Rotem Banin , Miroslav Baryakh , Anat Bazov , Stefano Brenna , Bryan K. Casper , Anandaroop Chakrabarti , Gregory Chance , Debabani Choudhury , Emanuel Cohen , Claudio Da Silva , Sidharth Dalmia , Saeid Daneshgar Asl , Kaushik Dasgupta , Kunal Datta , Brandon Davis , Ofir Degani , Amr M. Fahim , Amit Freiman , Michael Genossar , Eran Gerson , Eyal Goldberger , Eshel Gordon , Meir Gordon , Josef Hagn , Shinwon Kang , Te Yu Kao , Noam Kogan , Mikko S. Komulainen , Igal Yehuda Kushnir , Saku Lahti , Mikko M. Lampinen , Naftali Landsberg , Wook Bong Lee , Run Levinger , Albert Molina , Resti Montoya Moreno , Tawfiq Musah , Nathan G. Narevsky , Hosein Nikopour , Oner Orhan , Georgios Palaskas , Stefano Pellerano , Ron Pongratz , Ashoke Ravi , Shmuel Ravid , Peter Andrew Sagazio , Eren Sasoglu , Lior Shakedd , Gadi Shor , Baljit Singh , Menashe Soffer , Ra'anan Sover , Shilpa Talwar , Nebil Tanzi , Moshe Teplitsky , Chintan S. Thakkar , Jayprakash Thakur , Avi Tsarfati , Yossi Tsfati , Marian Verhelst , Nir Weisman , Shuhei Yamada , Ana M. Yepes , Duncan Kitchin
IPC: H01Q5/47 , H01Q1/24 , H01Q1/38 , H01Q1/48 , H01Q3/24 , H01Q9/04 , H01Q21/24 , H03L7/14 , H04B1/3827 , H04B7/0456 , H04B7/06 , H04B15/04
Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
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公开(公告)号:US12230866B2
公开(公告)日:2025-02-18
申请号:US17129698
申请日:2020-12-21
Applicant: Intel Corporation
Inventor: Jayprakash Thakur , Maruti Tamrakar , Sagar Gupta , Prasanna Pichumani , Sudheera Sudhakar
IPC: H01Q1/24 , H04B1/3827 , H04B1/401 , H04W52/36
Abstract: Various embodiments utilize part of an existing antenna pattern in a computing device to implement a specific absorption rate (SAR) sensor element using a radio frequency (RF) filter circuit. The integrated solutions of the present disclosure help to eliminate the external SAR sensor pad requirement and further help to improve wireless performance. The embodiments of the present disclosure may be implemented with a variety of different types of antenna (e.g., slot, metal ring/aperture, PCB, etc.). Other embodiments may be described and claimed.
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