公开(公告)号：US20240219462A1

公开(公告)日：2024-07-04

申请号：US18091060

申请日：2022-12-29

Applicant: Intel Corporation

Inventor： Rakesh KANDULA ,  Edward BRAZIL ,  Amir ZALTZMAN ,  Alon PERETZ ,  Alexander SEREBRYANIK ,  Chai ZIV ,  Nir BARUCH ,  Gilad SHAYEVITZ

IPC: G01R31/317

CPC classification number: G01R31/31705

Abstract: Examples include techniques for debug, survivability, and infield testing of a system-on-a-chip (SoC) or system-on-a-package (SoP) that can be configured as a processor. The techniques include using an agent coupled with a network-on-chip (NoC) fabric to launch transaction over the NoC fabric to test or debug agents, devices, or devices coupled to the SoC or SoP and/or interconnected to the NoC fabric.