公开(公告)号：US11569596B2

公开(公告)日：2023-01-31

申请号：US16833221

申请日：2020-03-27

申请人： Intel Corporation

发明人： Steven A. Klein ,  Kuang Liu ,  Srikant Nekkanty ,  Feroz Mohammad ,  Donald Tiendung Tran ,  Srinivasa Aravamudhan ,  Hemant Mahesh Shah ,  Alexander W. Huettis

IPC分类号： H01R12/00 ,  H01R12/70 ,  H01R43/04

摘要： Systems, apparatus, and/or processes directed to applying pressure to a socket to alter a shape of the socket to improve a connection between the socket and a substrate, printed circuit board, or other component. The socket may receive one or more chips, may be an interconnect, or may be some other structure that is part of a package. The shape of the socket may be flattened so that a side of the socket may form a high-quality physical and electrical coupling with the substrate.