公开(公告)号：US20220201889A1

公开(公告)日：2022-06-23

申请号：US17128620

申请日：2020-12-21

申请人： Intel Corporation

发明人： Raanan Sover ,  James Williams ,  Bradley Smith ,  Nir Peled ,  Paul George ,  Jason Armstrong ,  Alexey Chinkov ,  Meir Cohen ,  Je-Young Chang ,  Kuang Liu ,  Ravindranath Mahajan ,  Kelly Lofgreen ,  Kyle Arrington ,  Michael Crocker ,  Sergio Antonio Chan Arguedas

IPC分类号： H05K7/20

摘要： A two-phase immersion cooling system for an integrated circuit assembly may be formed utilizing boiling enhancement structures formed on or directly attached to heat dissipation devices within the integrated circuit assembly, formed on or directly attached to integrated circuit devices within the integrated circuit assembly, and/or conformally formed over support devices and at least a portion of an electronic board within the integrated circuit assembly. In still a further embodiment, the two-phase immersion cooling system may include a low boiling point liquid including at least two liquids that are substantially immiscible with one another.

公开(公告)号：US20220102892A1

公开(公告)日：2022-03-31

申请号：US17032587

申请日：2020-09-25

申请人： Intel Corporation

发明人： Srikant Nekkanty ,  Steven Klein ,  Feroz Mohammad ,  Joe Walczyk ,  Kuang Liu ,  Zhichao Zhang

IPC分类号： H01R13/11 ,  H05K1/02 ,  H05K9/00

摘要： Techniques and mechanisms for coupling packaged devices with a socket device. In an embodiment, the socket device comprises a socket body structure and conductors extending therethrough. A pitch of the conductors is in a range of between 0.1 millimeters (mm) and 3 mm. First and second metallization structures also extend, respectively, from opposite respective sides of the socket body structure. In the socket body structure, a conductive shield structure, electrically coupled to the first and second metallization structures, substantially extends around one of the conductors. For each of the first and second metallization structures, a vertical span of the metallization structure is in a range of between 0.05 mm and 2.0 mm, a portion of a side of the metallization structure forms a respective corrugation structure, and a horizontal span of the portion is at least 5% of the vertical span of the metallization structure.

公开(公告)号：US12127363B2

公开(公告)日：2024-10-22

申请号：US17033401

申请日：2020-09-25

申请人： Intel Corporation

发明人： Feifei Cheng ,  Thomas Boyd ,  Kuang Liu ,  Steven A. Klein ,  Daniel Neumann ,  Mohanraj Prabhugoud

IPC分类号： H05K7/10 ,  H01R12/52

CPC分类号： H05K7/1069 ,  H01R12/523

摘要： Embodiments disclosed herein include sockets and electronic packages with socket architectures. In an embodiment, a socket comprises a housing with a first surface and a second surface. In an embodiment, a plurality of interconnect pins pass through the housing. In an embodiment, an alignment hole is provided through the housing. In an embodiment, an alignment post extending out from the first surface of the housing is also provided.

公开(公告)号：US11569596B2

公开(公告)日：2023-01-31

申请号：US16833221

申请日：2020-03-27

申请人： Intel Corporation

发明人： Steven A. Klein ,  Kuang Liu ,  Srikant Nekkanty ,  Feroz Mohammad ,  Donald Tiendung Tran ,  Srinivasa Aravamudhan ,  Hemant Mahesh Shah ,  Alexander W. Huettis

IPC分类号： H01R12/00 ,  H01R12/70 ,  H01R43/04

摘要： Systems, apparatus, and/or processes directed to applying pressure to a socket to alter a shape of the socket to improve a connection between the socket and a substrate, printed circuit board, or other component. The socket may receive one or more chips, may be an interconnect, or may be some other structure that is part of a package. The shape of the socket may be flattened so that a side of the socket may form a high-quality physical and electrical coupling with the substrate.

公开(公告)号：US20170176516A1

公开(公告)日：2017-06-22

申请号：US14976881

申请日：2015-12-21

申请人： INTEL CORPORATION

发明人： Mohit Mamodia ,  Kyle Yazzie ,  Dingying David Xu ,  Kuang Liu ,  Paul J. Diglio ,  Pramod Malatkar

IPC分类号： G01R31/28 ,  H05B3/26

CPC分类号： H05B3/267 ,  G01R31/2867 ,  G01R31/2875

摘要： A thermal heat for integrated circuit die processing is described that includes a thermal barrier. In one example, the thermal head has a ceramic heater configured to carry an integrated circuit die, a metal base, and a thermal barrier between the heater and the base.

公开(公告)号：US11464139B2

公开(公告)日：2022-10-04

申请号：US16180499

申请日：2018-11-05

申请人： Intel Corporation

发明人： Kelly Lofgreen ,  Joseph Petrini ,  Todd Coons ,  Christopher Wade Ackerman ,  Edvin Cetegen ,  Yang Jiao ,  Michael Rutigliano ,  Kuang Liu

IPC分类号： H05K7/20

摘要： A conformable heat sink interface for an integrated circuit package comprises a mounting plate having a first surface and a deformable membrane having a portion bonded to a second surface of the plate. A cavity is between the second surface of the plate and the deformable membrane. A flowable heat transfer medium is within the cavity. The flowable heat transfer medium has a thermal conductivity of not less than 30 W/m K. The deformable membrane is to conform to a three-dimensional shape of an IC package and the mounting plate has a second surface that is to be adjacent to a heat sink base.

公开(公告)号：US11158969B2

公开(公告)日：2021-10-26

申请号：US15916678

申请日：2018-03-09

申请人： Intel Corporation

发明人： Feifei Cheng ,  Emad Al-Momani ,  Ahmet Durgun ,  Kuang Liu

IPC分类号： H01R3/00 ,  H01R12/72 ,  H05K3/30 ,  H05K7/10 ,  H01R12/70 ,  H01R12/85 ,  H01R12/88 ,  H01R24/60 ,  H01R107/00

摘要： Apparatuses, systems and methods associated with connector design for mating with integrated circuit packages are disclosed herein. In embodiments, a connector for mating with an integrated circuit (IC) package may include a housing with a recess to receive a portion of the IC package and a contact coupled to the housing and that extends into the recess. The contact may include a main body that extends from the housing into the recess and a curved portion that extends from an end of the main body, wherein the curved portion loops back and contacts the main body. Other embodiments may be described and/or claimed.

公开(公告)号：US12009612B2

公开(公告)日：2024-06-11

申请号：US17032587

申请日：2020-09-25

申请人： Intel Corporation

发明人： Srikant Nekkanty ,  Steven Klein ,  Feroz Mohammad ,  Joe Walczyk ,  Kuang Liu ,  Zhichao Zhang

IPC分类号： H01R13/11 ,  H05K1/02 ,  H05K9/00

CPC分类号： H01R13/11 ,  H05K1/0213 ,  H05K9/0022

摘要： Techniques and mechanisms for coupling packaged devices with a socket device. In an embodiment, the socket device comprises a socket body structure and conductors extending therethrough. A pitch of the conductors is in a range of between 0.1 millimeters (mm) and 3 mm. First and second metallization structures also extend, respectively, from opposite respective sides of the socket body structure. In the socket body structure, a conductive shield structure, electrically coupled to the first and second metallization structures, substantially extends around one of the conductors. For each of the first and second metallization structures, a vertical span of the metallization structure is in a range of between 0.05 mm and 2.0 mm, a portion of a side of the metallization structure forms a respective corrugation structure, and a horizontal span of the portion is at least 5% of the vertical span of the metallization structure.

公开(公告)号：US10455685B1

公开(公告)日：2019-10-22

申请号：US16159840

申请日：2018-10-15

申请人： Intel Corporation

发明人： Steven A. Klein ,  Kuang Liu ,  Thomas A. Boyd ,  Luis Gil Rangel ,  Muffadal Mukadem ,  Shelby A. Ferguson ,  Francis Toth, Jr. ,  Eric Buddrius ,  Ralph V. Miele ,  Sriram Srinivasan ,  Jeffory L. Smalley

IPC分类号： H01L23/522 ,  H01L23/485 ,  H01L23/32 ,  H05K1/02 ,  H05K3/30 ,  H01R12/70 ,  H05K7/10 ,  H01L23/367 ,  H05K3/36

摘要： An electronic device may include a circuit board, and the circuit board may include a dielectric material. A socket may be coupled to a first side of the circuit board, and the socket may be configured to receive a semiconductor package. A backing plate may be positioned on a second side of the circuit board. A spacer may be positioned between the backing plate and the circuit board. The spacer may alter the profile of the socket to provide a curved profile to the socket. The spacer may displace a portion of the socket in a first direction, for instance when the spacer is coupled between the backing plate and the circuit board.

公开(公告)号：US10044115B2

公开(公告)日：2018-08-07

申请号：US14757626

申请日：2015-12-23

申请人： Intel Corporation

发明人： Donald T. Tran ,  Gregorio Murtagian ,  Kuang Liu ,  Srikant Nekkanty ,  Feroz Mohammad ,  Karumbu Meyyappan ,  Hong Xie ,  Russell S. Aoki ,  Gaurav Chawla

IPC分类号： H01R4/50 ,  H01R13/639 ,  H01R4/52 ,  H01R13/508 ,  H01R12/85 ,  H01R12/72

摘要： An apparatus comprises a cable connector including: a first connector body portion including a first plurality of electrical contacts arranged to contact electrical contacts of a first surface of an edge connector substrate; a second connector body portion separate from the first connector body portion and including a second plurality of electrical contacts arranged to oppose the first plurality of electrical contacts of the first connector body portion and to contact electrical contacts of a second surface of the edge connector substrate, wherein the first and second plurality of electrical contacts are electrically coupled to one or more cables; and a joining mechanism configured to join the first connector body portion and the second connector body portion together and to apply a bias force to the edge connector substrate when the edge connector substrate is arranged between the first connector body portion and the second connector body portion.