公开(公告)号：US20230027585A1

公开(公告)日：2023-01-26

申请号：US17954430

申请日：2022-09-28

Applicant: Intel Corporation

Inventor： Lichen Weng ,  Ramadass Nagarajan ,  Anand Jayaraman ,  Vijeta Prasad ,  Justin Reyes ,  Gurucharapathy Karthikeyan

IPC: H04L45/745 ,  H04L49/109 ,  H04L45/16

Abstract: In one embodiment, a first chiplet includes: a plurality of agents to generate messages, each of the messages having a destination port identifier comprising a first portion to identify a destination chiplet and a second portion to identify a destination agent on the destination chiplet; a die-to die bridge to couple the first chiplet to a second chiplet; a fabric coupled to the die-to-die bridge to route communications between the plurality of agents, where a first agent is to generate a first message having a first destination port identifier; and a first fabric adapter coupled to the first agent, the first fabric adapter to direct the first message to the die-to-die bridge when the first portion of the first destination port identifier identifies a second chiplet as the destination chiplet. Other embodiments are described and claimed.