公开(公告)号：US20230027585A1

公开(公告)日：2023-01-26

申请号：US17954430

申请日：2022-09-28

Applicant: Intel Corporation

Inventor： Lichen Weng ,  Ramadass Nagarajan ,  Anand Jayaraman ,  Vijeta Prasad ,  Justin Reyes ,  Gurucharapathy Karthikeyan

IPC: H04L45/745 ,  H04L49/109 ,  H04L45/16

Abstract: In one embodiment, a first chiplet includes: a plurality of agents to generate messages, each of the messages having a destination port identifier comprising a first portion to identify a destination chiplet and a second portion to identify a destination agent on the destination chiplet; a die-to die bridge to couple the first chiplet to a second chiplet; a fabric coupled to the die-to-die bridge to route communications between the plurality of agents, where a first agent is to generate a first message having a first destination port identifier; and a first fabric adapter coupled to the first agent, the first fabric adapter to direct the first message to the die-to-die bridge when the first portion of the first destination port identifier identifies a second chiplet as the destination chiplet. Other embodiments are described and claimed.

公开(公告)号：US10911261B2

公开(公告)日：2021-02-02

申请号：US15383032

申请日：2016-12-19

Applicant: Intel Corporation

Inventor： Robert P. Adler ,  Lichen Weng ,  Christopher C. Gianos

IPC: H04L12/46

Abstract: In an embodiment, a system on chip includes: a plurality of local networks having one or more local endpoints and a first router, where at least some of the one or more local endpoints of different local networks have non-unique port identifiers; at least one global network having one or more global endpoints and at least one second router, where the one or more global endpoints have unique port identifiers; and a plurality of transparent bridges to couple between one of the plurality of local networks and the at least one global network. Other embodiments are described and claimed.

公开(公告)号：US20180176118A1

公开(公告)日：2018-06-21

申请号：US15383032

申请日：2016-12-19

Applicant: Intel Corporation

Inventor： Robert P. Adler ,  Lichen Weng ,  Christopher C. Gianos

IPC: H04L12/715 ,  H04L12/46 ,  H04L12/741

CPC classification number: H04L12/462 ,  H04L12/4625

Abstract: In an embodiment, a system on chip includes: a plurality of local networks having one or more local endpoints and a first router, where at least some of the one or more local endpoints of different local networks have non-unique port identifiers; at least one global network having one or more global endpoints and at least one second router, where the one or more global endpoints have unique port identifiers; and a plurality of transparent bridges to couple between one of the plurality of local networks and the at least one global network. Other embodiments are described and claimed.