公开(公告)号：US20240397662A1

公开(公告)日：2024-11-28

申请号：US18200994

申请日：2023-05-23

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Mark McDonald ,  Min Suet Lim ,  Tongyan Zhai ,  Shantanu D. Kulkarni ,  Arnab A. Sen ,  Juha Paavola

IPC: H05K7/20 ,  H05K5/02

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for accessories for electronic devices and removable fan cartridges for electronic devices. An example electronic device accessory includes a backplate panel removably couplable to a first chassis of a first electronic device to replace a portion of a first cover of the first chassis and removably couplable to a second chassis of a second electronic device to replace a portion of a second cover of the second chassis. The example electronic device accessory also includes a mating device to releasably couple the backplate panel to the first chassis and independently releasably couple the backplate panel to the second chassis and a fan coupled to the backplate panel. The fan is to increase a Z height of the first electronic device when the backplate panel is coupled to the first electronic device and increase a Z height of the second electronic device when the backplate panel is coupled to the second electronic device.