公开(公告)号：US20240213216A1

公开(公告)日：2024-06-27

申请号：US18597684

申请日：2024-03-06

Applicant: Intel Corporation

Inventor： Adel A. ELSHERBINI ,  Amr Elshazly ,  Arun CHANDRASEKHAR ,  Shawna M. LIFF ,  Johanna M. SWAN

IPC: H01L25/065 ,  H01L23/498 ,  H01L25/00

CPC classification number: H01L25/0652 ,  H01L23/49822 ,  H01L25/50

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate, a first die coupled to the package substrate with first interconnects, and a second die coupled to the first die with second interconnects, wherein the second die is coupled to the package substrate with third interconnects, a communication network is at least partially included in the first die and at least partially included in the second die, and the communication network includes a communication pathway between the first die and the second die.

公开(公告)号：US20240355750A1

公开(公告)日：2024-10-24

申请号：US18758992

申请日：2024-06-28

Applicant: Intel Corporation

Inventor： Adel A. ELSHERBINI ,  Amr ELSHAZLY ,  Arun CHANDRASEKHAR ,  Shawna M. LIFF ,  Johanna M. SWAN

IPC: H01L23/538 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L23/5385 ,  H01L24/16 ,  H01L24/17 ,  H01L25/00 ,  H01L2224/16225 ,  H01L2224/1703

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate, a first die coupled to the package substrate with first interconnects, and a second die coupled to the first die with second interconnects, wherein the second die is coupled to the package substrate with third interconnects, a communication network is at least partially included in the first die and at least partially included in the second die, and the communication network includes a communication pathway between the first die and the second die.

公开(公告)号：US20230343716A1

公开(公告)日：2023-10-26

申请号：US18216102

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Adel A. ELSHERBINI ,  Amr ELSHAZLY ,  Arun CHANDRASEKHAR ,  Shawna M. LIFF ,  Johanna M. SWAN

IPC: H01L23/538 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L23/5385 ,  H01L24/16 ,  H01L24/17 ,  H01L25/00 ,  H01L2224/16225 ,  H01L2224/1703

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate, a first die coupled to the package substrate with first interconnects, and a second die coupled to the first die with second interconnects, wherein the second die is coupled to the package substrate with third interconnects, a communication network is at least partially included in the first die and at least partially included in the second die, and the communication network includes a communication pathway between the first die and the second die.