公开(公告)号：US20240312690A1

公开(公告)日：2024-09-19

申请号：US18120761

申请日：2023-03-13

Applicant: Intel Corporation

Inventor： Ashish SHARMA ,  Arvind SUNDARAM ,  Vikas MISHRA ,  Vimal John CYRIL

IPC: H01F27/28 ,  H01F27/26 ,  H05K1/16 ,  H05K3/00

CPC classification number: H01F27/2804 ,  H01F27/266 ,  H05K1/165 ,  H05K3/005 ,  H01F2027/2809

Abstract: Embodiments disclosed herein include a motherboard. In an embodiment, the motherboard comprises a first layer with a first trace with a shape. In an embodiment, an insulating layer is provided over the first layer. In an embodiment, a second layer with a second trace with the shape is over the insulating layer. In an embodiment, the second trace is provided directly over the first trace.