公开(公告)号：US20220326962A1

公开(公告)日：2022-10-13

申请号：US17847166

申请日：2022-06-22

Applicant: Intel Corporation

Inventor： Navneeth JAYARAJ ,  Richard Marian THOMAIYAR ,  Ashraf JAVEED ,  Vikas MISHRA ,  Rajesh POORNACHANDRAN ,  Mahammad Yaseen Isasaheb MULLA ,  Laxminarayan KAMATH ,  Karunakara KOTARY ,  Dustin FREDRICKSON

IPC: G06F9/4401 ,  G06F1/28

Abstract: An apparatus is described. The apparatus includes an accelerator having an interface to plug into an electronic system. The accelerator includes a field programmable gate array integrated circuit to perform acceleration, a general purpose processor integrated circuit to execute software related to the acceleration and controller circuitry to dynamically change, without rebooting the general purpose processor integrated circuit, allocation of the accelerator's power budget to the field programmable gate array integrated circuit and the general purpose processor integrated circuit.

公开(公告)号：US20240231455A1

公开(公告)日：2024-07-11

申请号：US18558180

申请日：2021-09-01

Applicant: Intel Corporation

Inventor： Manish SHARMA ,  Vikas MISHRA ,  Richard Marian THOMAIYAR ,  Vikram BODIREDDY ,  Ashraf JAVEED ,  Satish MUTHIYALU

IPC: G06F1/20

CPC classification number: G06F1/206

Abstract: Apparatus and methods for implementing an adaptive Dynamic Temperature Range (DTR) control mechanism to extend dynamic temperature range. A DTR control manager is provided to initiate retrain/recalibrate high-speed IO (input-output) links without link reset and extend the dynamic temperature range to the entire operating range based on thermal and other conditions. The DTR control manager ensures optimized retraining/recalibration of the link, which is based on system level parameters (like ambient temperature, fan speed, thermal zone of the devices etc.) and other environmental conditions. In some embodiments the mechanism or algorithm of the DTR control manager can be implemented in a BMC (Baseboard Management controller) or the like and hence enables the adaptive DTR solution in an operating system (OS) agnostic and seamless manner.

公开(公告)号：US20240312690A1

公开(公告)日：2024-09-19

申请号：US18120761

申请日：2023-03-13

Applicant: Intel Corporation

Inventor： Ashish SHARMA ,  Arvind SUNDARAM ,  Vikas MISHRA ,  Vimal John CYRIL

IPC: H01F27/28 ,  H01F27/26 ,  H05K1/16 ,  H05K3/00

CPC classification number: H01F27/2804 ,  H01F27/266 ,  H05K1/165 ,  H05K3/005 ,  H01F2027/2809

Abstract: Embodiments disclosed herein include a motherboard. In an embodiment, the motherboard comprises a first layer with a first trace with a shape. In an embodiment, an insulating layer is provided over the first layer. In an embodiment, a second layer with a second trace with the shape is over the insulating layer. In an embodiment, the second trace is provided directly over the first trace.