公开(公告)号：US20160192544A1

公开(公告)日：2016-06-30

申请号：US14583530

申请日：2014-12-26

Applicant: Intel Corporation

Inventor： RUSSELL S. AOKI ,  MARK E. SPRENGER ,  HUE V. LAM ,  BRANDON COURTNEY ,  SHANTANU D. KULKARNI ,  DENICA N. LARSEN

IPC: H05K9/00 ,  H05K7/20

CPC classification number: H05K9/0007 ,  G06F1/203 ,  H05K7/205 ,  H05K9/005

Abstract: In one example a electronic device comprises a housing, a circuit board comprising a plurality of heat generating components, a chassis, wherein the chassis comprises a cut-out section configured to receive the circuit board, an electromagnetic interference (EMI) shield is configured to cover the plurality of heat generating components on the circuit board and to be physically connected to the chassis, wherein the electromagnetic interference shield comprises at least one structural component. Other examples may be described.

Abstract translation: 在一个示例中，电子设备包括壳体，包括多个发热部件的电路板，底架，其中底盘包括被配置为接收电路板的切口部分，电磁干扰（EMI）屏蔽被配置为 覆盖电路板上的多个发热部件并且物理地连接到底架，其中电磁干扰屏蔽包括至少一个结构部件。 可以描述其他示例。