公开(公告)号：US12148742B2

公开(公告)日：2024-11-19

申请号：US16816669

申请日：2020-03-12

Applicant: Intel Corporation

Inventor： Thomas Liljeberg ,  Andrew C. Alduino ,  Ravindranath Vithal Mahajan ,  Ling Liao ,  Kenneth Brown ,  James Jaussi ,  Bharadwaj Parthasarathy ,  Nitin A Deshpande

IPC: G02B6/42 ,  H01L23/00 ,  H01L23/36 ,  H01L23/367 ,  H01L25/16 ,  H04B10/40

Abstract: Embodiments may relate to a microelectronic package that includes a package substrate with an active bridge positioned therein. An active die may be coupled with the package substrate, and communicatively coupled with the active bridge. A photonic integrated circuit (PIC) may also be coupled with the package substrate and communicatively coupled with the active bridge. Other embodiments may be described or claimed.

公开(公告)号：US20210132650A1

公开(公告)日：2021-05-06

申请号：US16950828

申请日：2020-11-17

Applicant: Intel Corporation

Inventor： Wenhua Lin ,  Casimir Wierzynski ,  Amir Khosrowshahi ,  Bharadwaj Parthasarathy ,  Jin Hong ,  Robert Blum

IPC: G06E3/00 ,  G06N3/067 ,  G02F1/365

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for a photonics integrated circuit (IC) for an optical neural network (ONN). In embodiments, the photonics IC includes monolithically optoelectronic components in a single semiconductor substrate including a combination of one or more of integrated array of light sources, a plurality of optical modulators, an optical unitary matrix multiplier, non-linear optical amplifiers or attenuators, and a plurality of photodetectors. In embodiments, the optical unitary matrix multiplier comprises a plurality of 2×2 unitary optical matrices optically interconnected, wherein each 2×2 unitary optical matrix comprises a plurality of phase shifters. In embodiments, each 2×2 unitary optical matrix is to phase shift, split, and/or combine one or more of the optical signal inputs. Other embodiments may be described and/or claimed.

公开(公告)号：US20210288035A1

公开(公告)日：2021-09-16

申请号：US16816669

申请日：2020-03-12

Applicant: Intel Corporation

Inventor： Thomas Liljeberg ,  Andrew C. Alduino ,  Ravindranath Vithal Mahajan ,  Ling Liao ,  Kenneth Brown ,  James Jaussi ,  Bharadwaj Parthasarathy ,  Nitin A. Deshpande

IPC: H01L25/16 ,  H01L23/00 ,  G02B6/42 ,  H01L23/367 ,  H04B10/40

Abstract: Embodiments may relate to a microelectronic package that includes a package substrate with an active bridge positioned therein. An active die may be coupled with the package substrate, and communicatively coupled with the active bridge. A photonic integrated circuit (PIC) may also be coupled with the package substrate and communicatively coupled with the active bridge. Other embodiments may be described or claimed.

公开(公告)号：US20210064958A1

公开(公告)日：2021-03-04

申请号：US16950824

申请日：2020-11-17

Applicant: Intel Corporation

Inventor： Wenhua Lin ,  Erik Norden ,  Bharadwaj Parthasarathy ,  Jin Hong ,  Minnie Ho

IPC: G06N3/04 ,  G06E1/04 ,  G06E3/00 ,  G02B6/28 ,  G06N3/067

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for an optical accelerator including a photonics integrated circuit (PIC) for an optical neural network (ONN). In embodiments, an optical accelerator package includes the PIC and an electronics integrated circuit (EIC) that is heterogeneously integrated into the optical accelerator package to proximally provide pre- and post-processing of optical signal inputs and optical signal outputs provided to and received from an optical matrix multiplier of the PIC. In some embodiments, the EIC is a single EIC or discrete EICs to provide pre- and post-processing of the optical signal inputs and optical signal outputs including optical to electrical and electrical to optical transduction. Other embodiments may be described and/or claimed.

公开(公告)号：US20190137842A1

公开(公告)日：2019-05-09

申请号：US16231915

申请日：2018-12-24

Applicant: Intel Corporation

Inventor： Syed S. Islam ,  Raghuram Narayan ,  Syed Reza Bahadur ,  Bharadwaj Parthasarathy

IPC: G02F1/225 ,  G02F1/025 ,  H04B10/548

Abstract: Embodiments may relate to a segment driver that is to be coupled with a modulator segment of a Mach-Zehnder modulator. The segment driver may include a continuous-time linear equalizer (CTLE) incorporated within an amplifier stage of the modulator. The CTLE may be configured to identify an electrical signal that is related to an optical signal of the Mach-Zehnder modulator; reduce inter-symbol interference (ISI) of the electrical signal to generate a processed electrical signal; and output the processed electrical signal to the amplifier stage. Other embodiments may be described or claimed.