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公开(公告)号：US20210072784A1
公开(公告)日：2021-03-11
申请号：US16950815
申请日：2020-11-17
Applicant: Intel Corporation
Inventor： Wenhua Lin , Haisheng Rong , Jin Hong
Abstract: Embodiments of the present disclosure describe techniques and configurations for a nonlinear optical device used to construct an optical neural network (ONN) with an arbitrary number of layers of matrix multipliers. The nonlinear optical device includes a waveguide to receive optical input and a gain medium coupled with the waveguide, to amplify or attenuate the received optical input, to provide an output that is amplified in a nonlinear manner in response to the optical input reaching saturation, where the nonlinearly amplified output is to provide a nonlinear activation function for an ONN. Additional embodiments may be described and claimed.
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公开(公告)号：US20240369898A1
公开(公告)日：2024-11-07
申请号：US18772564
申请日：2024-07-15
Applicant: Intel Corporation
Inventor： Jin Hong
IPC: G02F1/225 , G02F1/21 , H04B10/548
Abstract: Embodiments may relate to an electronic device that includes a modulator to modulate an in-phase portion of an input signal and a quadrature portion of the input signal. The modulator may include a III-V material on a silicon substrate. In some embodiments, the III-V material may include, for example, indium phosphide (InP). Other embodiments may be described or claimed.
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公开(公告)号：US20220400548A1
公开(公告)日：2022-12-15
申请号：US17555022
申请日：2021-12-17
Applicant: Intel Corporation
Inventor： Sanjeev Gupta , Jin Hong
Abstract: Various embodiments disclosed relate to LiDAR systems. The present disclosure includes a method and assemblies for connection photonics modules to LiDAR systems. In an example, a connection assembly can include a system board, a flex printed circuit board (PCB) connected to the system board through an interface, a photonics integrated circuit die mounted on a first side of the flex PCB and an electronic integrated circuit die mounted on a second side of the flex PCB, opposite the first side.
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4.发明申请公开(公告)号：US20210373410A1
公开(公告)日：2021-12-02
申请号：US17397724
申请日：2021-08-09
Applicant: Intel Corporation
Inventor： Jianying Zhou , Jin Hong
Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques directed to phase match and impedance match to enable a higher baud rate for ultra-high-speed TW-MZM for 100 Gbaud or above for PAM applications, and/or 120 Gbaud or above for QAM applications. Embodiments described herein may include ultra-high-speed TW-MZM based on differential signal-to-signal (SS) TW using a push-pull PN structure. These embodiments facilitate high speeds for a TW-MZM due to decreased complexity by eliminating a ground in the TW. Other embodiments may be described and/or claimed.
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公开(公告)号：US20210314068A1
公开(公告)日：2021-10-07
申请号：US17353853
申请日：2021-06-22
Applicant: Intel Corporation
Inventor： Christian Malouin , Jin Hong , Wenhua Lin
Abstract: In one embodiment, an apparatus comprises: a coherent optical receiver front-end circuit to receive an optical signal comprising information and further to receive a local oscillator optical signal, and output an orthogonal electrical signal based on the optical signal; a processing circuit coupled to the coherent optical receiver front-end circuit to receive the orthogonal electrical signal and process the orthogonal electrical signal to generate therefrom sum of squares information; and a non-coherent receiver coupled to the processing circuit to recover the information from the sum of squares information. Other embodiments are described and claimed.
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Patent Agency Ranking
公开(公告)号：US20220221743A1
公开(公告)日：2022-07-14
申请号：US17711922
申请日：2022-04-01
Applicant: Intel Corporation
Inventor： Sanjeev Gupta , Olufemi I. Dosunmu , Nikolai Fediakine , Jin Hong , David Chak Wang Hui , Christian Malouin , Meer Nazmus Sakib , Jianying Zhou
Abstract: Techniques for termination for microring modulators are disclosed. In the illustrative embodiment, a microring modulator on a photonic integrated circuit (PIC) die is modulated by radiofrequency (RF) signals connected to electrodes across the microring modulator. A resistor is connected to each of the electrodes. The resistors both provide termination for the RF signals, preventing or reducing reflections, as well as forming part of a bias tee, allowing for a DC bias voltage to be applied across the electrodes.
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公开(公告)号：US20220221566A1
公开(公告)日：2022-07-14
申请号：US17707882
申请日：2022-03-29
Applicant: Intel Corporation
Inventor： Jin Hong , Jianying Zhou , Sanjeev Gupta , Syed S. Islam , Christian Malouin
IPC: G01S7/4913 , G01S7/481
Abstract: Filter circuitry is provided for use with a light detection and ranging (Lidar) device implemented using silicon photonics. The filter circuitry includes high-pass filter circuitry to receive a signal from a photodetector of the lidar device and attenuate a lower frequency portion of the signal, where the lower frequency portion of the signal is the result of optical back reflections within the lidar device.
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公开(公告)号：US20210373412A1
公开(公告)日：2021-12-02
申请号：US17403622
申请日：2021-08-16
Applicant: Intel Corporation
Inventor： Jin Hong , Jianying Zhou
Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques directed to a multiple traveling waveguide structure to synthesize EO frequency responses used for optical modulation. Multiple traveling waveguide devices may include a plurality of traveling waveguides, each with different characteristics resulting in a different EO response within a target frequency range. These different characteristics may be achieved by varying the PN junction, PN doping level, optical waveguides, RF waveguides and the like for each traveling waveguide. The multiple traveling waveguide structure is formed by combining each traveling waveguide in a serial and/or parallel fashion, and then iteratively optimized based on artificial intelligence (AI) training sequences, to achieve an overall optical modulation beyond 100 GHz. Other embodiments may be described and/or claimed.
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公开(公告)号：US20210064958A1
公开(公告)日：2021-03-04
申请号：US16950824
申请日：2020-11-17
Applicant: Intel Corporation
Inventor： Wenhua Lin , Erik Norden , Bharadwaj Parthasarathy , Jin Hong , Minnie Ho
Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for an optical accelerator including a photonics integrated circuit (PIC) for an optical neural network (ONN). In embodiments, an optical accelerator package includes the PIC and an electronics integrated circuit (EIC) that is heterogeneously integrated into the optical accelerator package to proximally provide pre- and post-processing of optical signal inputs and optical signal outputs provided to and received from an optical matrix multiplier of the PIC. In some embodiments, the EIC is a single EIC or discrete EICs to provide pre- and post-processing of the optical signal inputs and optical signal outputs including optical to electrical and electrical to optical transduction. Other embodiments may be described and/or claimed.
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公开(公告)号：US20200252133A1
公开(公告)日：2020-08-06
申请号：US16854450
申请日：2020-04-21
Applicant: Intel Corporation
Inventor： Jin Hong , Wenhua Lin
Abstract: Embodiments may relate to an optical transmitter that includes a laser to produce an optical signal, and a modulator to encode data into the optical signal to produce an optical data signal. The optical transmitter may further include an amplifier that is to amplify a power of the optical data signal to produce an output signal. Other embodiments may be described or claimed.
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