公开(公告)号：US20240130068A1

公开(公告)日：2024-04-18

申请号：US18399565

申请日：2023-12-28

Applicant: Intel Corporation

Inventor： Nan Wang ,  Zhichao Z. Zhang ,  Lihui Wu ,  Jialiang Xu ,  Xiaoguo Liang ,  Bo Chen ,  Haifeng Gong

IPC: H05K7/14 ,  H01R12/79 ,  H05K1/02

CPC classification number: H05K7/1492 ,  H01R12/79 ,  H05K1/0213 ,  H05K7/1402 ,  H05K2201/0154 ,  H05K2201/10386

Abstract: Technologies for a flexible three-dimensional power plane in a chassis are disclosed. In one embodiment, a flexible ribbon cable is laid along a circuit board tray. The flexible ribbon cable is secured to the tray using power bosses. The power bosses connect to one or more conductors on the ribbon cable. When the circuit board is mounted on the circuit board tray, the power bosses extend through holes in the circuit board and mate with power clips on the surface of the circuit board tray. The ribbon cable, power bosses, and power clips can distribute power to various locations on the circuit board, without requiring large traces that take up space on the circuit board.