THERMAL CONTROL FOR PROCESSOR-BASED DEVICES
    2.
    发明公开

    公开(公告)号:US20240251522A1

    公开(公告)日:2024-07-25

    申请号:US18587499

    申请日:2024-02-26

    CPC classification number: H05K7/20154 H05K7/20209 H05K7/209 H05K7/20927

    Abstract: The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include a rotatable mount; a first heat sink including a first surface and a second surface, the first surface of the first heat sink to be thermally coupled to a semiconductor device on a substrate, the second surface of the first heat sink thermally coupled to the rotatable mount; and a second heat sink including a third surface, the third surface of the second heat sink coupled to the rotatable mount, the second heat sink structured to rotate relative to the first heat sink when a portion of the rotatable mount rotates between a first position and a second position.

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