公开(公告)号：US20190006294A1

公开(公告)日：2019-01-03

申请号：US16002926

申请日：2018-06-07

Applicant: Intel Corporation

Inventor： Jenny Shio Yin Ong ,  Seok Ling Lim ,  Kang Eu Ong ,  Bok Eng Chea ,  Jackson Chung Peng Kong

IPC: H01L23/00 ,  H01L23/552

Abstract: Stiffener technology for electronic device packages is disclosed. A stiffener for a package substrate can include a top portion configured to be affixed to a top surface of a package substrate. The stiffener for a package substrate can also include a lateral portion extending from the top portion and configured to be disposed about a lateral side of the package substrate. An electronic device package and associated systems and methods are also disclosed.