公开(公告)号：US20210082852A1

公开(公告)日：2021-03-18

申请号：US16572354

申请日：2019-09-16

Applicant: Intel Corporation

Inventor： Bradon C. MARIN ,  Jung Kyu HAN ,  Thomas HEATON ,  Ali LEHAF ,  Rahul MANEPALLI ,  Srinivas PIETAMBARAM ,  Jacob VEHONSKY

IPC: H01L23/00 ,  C25D3/38 ,  C25D7/12 ,  C25D5/02

Abstract: Embodiments of the present disclosure may generally relate to systems, apparatus, and/or processes directed to manufacturing a package having a substrate with a first side and a second side opposite the first side, where a copper layer is coupled with a first region of the first side of the substrate and includes a plurality of bumps coupled with the first region of the first side of the substrate where one or more second regions on the first side of the substrate not coupled with a copper layer, and where a layout of the one or more second regions on the first side of the substrate is to vary a growth, respectively, of each of the plurality of bumps during a plating process by modifying a local copper density of each of the plurality of bumps.